ML610Q412P-NNNTB03A7 Rohm Semiconductor, ML610Q412P-NNNTB03A7 Datasheet - Page 24

• Manufacturer Part Number: ML610Q412P-NNNTB03A7
• Description: MCU 8BIT 16K FLASH 120-TQFP
• Manufacturer: Rohm Semiconductor

Specifications of ML610Q412P-NNNTB03A7

• Core Processor: nX-U8/100
• Core Size: 8-Bit
• Speed: 625kHz
• Connectivity: I²C, SSP, UART/USART
• Peripherals: LCD, POR, PWM, WDT
• Number Of I /o: 14
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 2x12b, 2x24b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

1.3.1.3
* Dummy pad
Note: These dummy pads are visible and do have any function, they are placed for a mechanical evaluation in Oki
semiconductor. Please do NOT implement wire-bonding to the dummy pad.
Note:
The assignment of the P30 to P35 are not in order.
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30 100
SEG31 101
SEG32 102
SEG33 103
SEG34 104
SEG35 105
PA0 106
PA1 107
PA2 108
PA3 109
PA4 110
PA5 111
PA6 112
PA7 113
Pin Layout of ML610Q411/ML610Q415 Chip
91
92
93
94
95
96
97
98
99
*
Figure 1-5 Dimensions of ML610Q411/ML610Q415 Chip
Chip size:
PAD count:
Minimum PAD pitch:
PAD aperture:
Chip thickness:
Voltage of the rear side of chip: V
2.836mm
1 – 9
ML610Q411/ML610Q412/ML610Q415 User’s Manual
2.836mm x 2.636mm
95 pins
80 µm
70 µm × 70 µm
350 µm
SS
level
47 VSS
46 VDD
45 VSS
44 P03
43 P02
42 P01
41 P00
40 NMI
39 P11
38 P10
37 (NC)
36 AIN1
35 AIN0
2.636mm
Chapter 1 Overview