ML610Q412P-NNNTB03A7 Rohm Semiconductor, ML610Q412P-NNNTB03A7 Datasheet - Page 86

no-image

ML610Q412P-NNNTB03A7

Manufacturer Part Number
ML610Q412P-NNNTB03A7
Description
MCU 8BIT 16K FLASH 120-TQFP
Manufacturer
Rohm Semiconductor

Specifications of ML610Q412P-NNNTB03A7

Core Processor
nX-U8/100
Core Size
8-Bit
Speed
625kHz
Connectivity
I²C, SSP, UART/USART
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
14
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.1 V ~ 3.6 V
Data Converters
A/D 2x12b, 2x24b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ML610Q412P-NNNTB03A7
Manufacturer:
ROHM
Quantity:
750
Part Number:
ML610Q412P-NNNTB03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
6.
6.1
6.1.1
• Low-speed clock: 32.768 kHz crystal oscillation mode
ML610Q411/ML610Q412:
• High-speed clock: Software selection
6.1.2
The clock generation circuit generates and provides a low-speed clock (LSCLK), 2× low-speed clock (LSCLK2), a
high-speed clock (HSCLK), a system clock (SYSCLK), and a high-speed output clock (OUTCLK).
LSCLK×2, and HSCLK are time base clocks for the peripheral circuits, SYSCLK is a basic operation clock of CPU,
and OUTCLK is a clock that is output from a port.
For the OUTCLK output port, see Chapter 19, “Port 2”. Additionally, for the STOP mode described in this chapter, see
Chapter 4, “MCU Control Function”, and for BLD, see Chapter 27, “Battery Level Detection Circuit”.
Figure 6-1 shows the configuration of the clock generation circuit.
Note:
This LSI starts operation with a clock generated by dividing the 500 kHz RC oscillation frequency by 8 after power-on
or a system reset. At initialization by software, set the FCON0 or FCON1 register to switch the clock to a required
one. Operation of ML610Q411/ ML610Q412 is not guaranteed under a condition where a low-speed clock is not
supplied.
ML610Q411/ML610Q412:
− 32.768kHz Crystal oscillation mode
− Capable of generating LSCLK × 2 (64 kHz) to be used for some peripherals.
− 1/16 of 500kHz RC oscillation mode (31.25kHz)
− Capable of generating LSCLK × 2 (62.5kHz) to be used for some peripherals.
− 500 kHz RC oscillation mode
− External clock input mode (Not available on ML610Q415)
FCON0
FCON1
*
*
1
2
Clock Generation Circuit
Overview
P10/OSC0
P11/OSC1
Features
Configuration
XT0*
XT1*
: Frequency control register 0
: Frequency control register 1
:Not used on ML610Q415
:The SYSCLK is fixed to HSCLK on ML610Q415
1
1
clock generation
clock generation
High-speed
Low-speed
circuit
circuit
Figure 6-1 Configuration of Clock Generation Circuit
OSCLK
FCON0, FCON1
1/1, 1/2, 1/4, 1/8
1/1, 1/2, 1/4, 1/8
Divide ratio
Divide ratio
selection
selection
6 – 1
ML610Q411/ML610Q412/ML610Q415 User’s Manual
*
2
Chapter 6 Clock Generation Circuit
System clock
(SYSCLK)
2
(LSCLK
Low-speed clock
(LSCLK)
High-speed clock
(HSCLK)
High-speed output clock
(OUTCLK)
Data bus
×
low-speed clock
×
2)
LSCLK,

Related parts for ML610Q412P-NNNTB03A7