MT47H64M16HR-3 IT:H Micron Technology Inc, MT47H64M16HR-3 IT:H Datasheet - Page 129
MT47H64M16HR-3 IT:H
Manufacturer Part Number
MT47H64M16HR-3 IT:H
Description
DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin FBGA Tray
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H64M16HR-3_ITH.pdf
(134 pages)
Specifications of MT47H64M16HR-3 IT:H
Density
1 Gb
Maximum Clock Rate
667 MHz
Package
84FBGA
Operating Supply Voltage
1.8 V
Maximum Random Access Time
0.45 ns
Operating Temperature
-40 to 85 °C
Organization
64Mx16
Address Bus
16b
Access Time (max)
450ps
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
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Figure 80: ODT Timing for Entering and Exiting Power-Down Mode
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
CKE
Applicable modes
Applicable timing parameters
t
AOND/
Any mode except
self refresh mode
Synchronous
t
AOFD
First CKE latched LOW
t
ANPD (3
t
CKs)
Active power-down slow (asynchronous)
Precharge power-down (asynchronous)
Active power-down fast (synchronous)
t
AONPD/
t
AOND/
Synchronous or
t
Asynchronous
t
AOFPD (asynchronous)
AOFD (synchronous)
129
Micron Technology, Inc. reserves the right to change products or specifications without notice.
First CKE latched HIGH
1Gb: x4, x8, x16 DDR2 SDRAM
t
AXPD (8
t
CKs)
© 2004 Micron Technology, Inc. All rights reserved.
Any mode except
self refresh mode
t
AOND/
Synchronous
ODT Timing
t
AOFD
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