MT47H64M16HR-3 IT:H Micron Technology Inc, MT47H64M16HR-3 IT:H Datasheet - Page 20
MT47H64M16HR-3 IT:H
Manufacturer Part Number
MT47H64M16HR-3 IT:H
Description
DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin FBGA Tray
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H64M16HR-3_ITH.pdf
(134 pages)
Specifications of MT47H64M16HR-3 IT:H
Density
1 Gb
Maximum Clock Rate
667 MHz
Package
84FBGA
Operating Supply Voltage
1.8 V
Maximum Random Access Time
0.45 ns
Operating Temperature
-40 to 85 °C
Organization
64Mx16
Address Bus
16b
Access Time (max)
450ps
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
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Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Dimensions apply to
solder balls post-
reflow on Ø0.35
SMD ball pads.
60X Ø0.45
8 CTR
Seating
0.12 A
plane
0.8 TYP
0.8 TYP
Notes:
A
9
8
7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
6.4 CTR
36%Pb, 2% Ag).
8 ±0.1
3
2
1
A
B
C
D
E
F
G
H
J
K
L
Exposed
gold-plated pad
1.0 MAX X 0.7
nonconductive
floating pad
0.8 ±0.1
Ball A1 ID
11.5 ±0.1
20
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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