MT47H64M16HR-3 IT:H Micron Technology Inc, MT47H64M16HR-3 IT:H Datasheet - Page 29

• Manufacturer Part Number: MT47H64M16HR-3 IT:H
• Description: DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin FBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H64M16HR-3 IT:H

• Density: 1 Gb
• Maximum Clock Rate: 667 MHz
• Package: 84FBGA
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 0.45 ns
• Operating Temperature: -40 to 85 °C
• Organization: 64Mx16
• Address Bus: 16b
• Access Time (max): 450ps
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 135mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Table 10: DDR2 I
Notes: 1–7 apply to the entire table
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Parameter/Condition
Operating burst write current:
All banks open, continuous burst
writes; BL = 4, CL = CL (I
t
(I
CS# is HIGH between valid com-
mands; Address bus inputs are
switching; Data bus inputs are
switching
Operating burst read current:
All banks open, continuous burst
reads, I
(I
t
is HIGH, CS# is HIGH between valid
commands; Address bus inputs are
switching; Data bus inputs are
switching
Burst refresh current:
(I
t
is HIGH between valid commands;
Other control and address bus in-
puts are switching; Data bus inputs
are switching
Self refresh current: CK and CK#
at 0V; CKE ≤ 0.2V; Other control
and address bus inputs are floating;
Data bus inputs are floating
Operating bank interleave read
current: All bank interleaving
reads, I
(I
t
=
is HIGH, CS# is HIGH between valid
commands; Address bus inputs are
stable during deselects; Data bus in-
puts are switching; See on page
for details
CK =
RAS MAX (I
RFC (I
CK =
DD
DD
DD
DD
t
RRD (I
),
), AL = 0;
); REFRESH command at every
), AL =
t
t
t
RP =
DD
CK (I
CK (I
OUT
OUT
) interval; CKE is HIGH, CS#
DD
t
),
DD
= 0mA; BL = 4, CL = CL
= 0mA; BL = 4, CL = CL
DD
t
RCD (I
RP (I
DD
t
t
),
),
RCD =
CK =
),
t
t
RAS =
RC =
DD
t
RP =
DD
); CKE is HIGH,
t
DD
CK (I
) - 1 ×
t
RCD (I
t
RC (I
Notes:
t
t
RP (I
Specifications and Conditions (Die Revisions E and G) (Continued)
RAS MAX
DD
DD
t
CK =
t
), AL = 0;
DD
),
CK (I
DD
DD
t
),
RAS =
); CKE
); CKE
t
t
1. I
2. V
3. I
CK
RRD
DD
);
DD
DD
DD
specifications are tested after the device is properly initialized. 0°C ≤ T
parameters are specified with ODT disabled.
Symbol
= +1.8V ±0.1V, V
I
I
I
DD4W
I
I
I
DD4R
DD6L
DD5
DD6
DD7
Configuration
x4, x8, x16
x4, x8
x4, x8
DDQ
x16
x16
x16
x16
x4
x8
x4
x8
= +1.8V ±0.1V, V
29
Electrical Specifications – I
-187E
190
210
405
190
210
420
265
300
425
520
7
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
DDL
-25E/
145
160
315
145
160
320
235
280
335
440
-25
7
5
1Gb: x4, x8, x16 DDR2 SDRAM
= +1.8V ±0.1V, V
-3E/
120
135
200
120
135
220
215
270
280
350
-3
7
5
© 2004 Micron Technology, Inc. All rights reserved.
-37E
110
125
180
110
125
180
210
250
270
330
REF
7
5
= V
DD
DDQ
105
160
105
160
205
240
260
300
-5E
90
90
Parameters
/2.
7
5
C
≤ +85°C.
Units
mA
mA
mA
mA
mA