MT47H64M16HR-3 IT:H Micron Technology Inc, MT47H64M16HR-3 IT:H Datasheet - Page 4

• Manufacturer Part Number: MT47H64M16HR-3 IT:H
• Description: DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin FBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H64M16HR-3 IT:H

• Density: 1 Gb
• Maximum Clock Rate: 667 MHz
• Package: 84FBGA
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 0.45 ns
• Operating Temperature: -40 to 85 °C
• Organization: 64Mx16
• Address Bus: 16b
• Access Time (max): 450ps
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 135mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Contents
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 15
Packaging ...................................................................................................................................................... 19
Electrical Specifications – Absolute Ratings ..................................................................................................... 23
Electrical Specifications – I
AC Timing Operating Specifications ................................................................................................................ 34
AC and DC Operating Conditions .................................................................................................................... 44
ODT DC Electrical Characteristics ................................................................................................................... 45
Input Electrical Characteristics and Operating Conditions ............................................................................... 46
Output Electrical Characteristics and Operating Conditions ............................................................................. 49
Output Driver Characteristics ......................................................................................................................... 51
Power and Ground Clamp Characteristics ....................................................................................................... 55
AC Overshoot/Undershoot Specification ......................................................................................................... 56
Input Slew Rate Derating ................................................................................................................................ 58
Commands .................................................................................................................................................... 71
Mode Register (MR) ........................................................................................................................................ 77
Extended Mode Register (EMR) ....................................................................................................................... 82
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Industrial Temperature .............................................................................................................................. 10
Automotive Temperature ........................................................................................................................... 11
General Notes ............................................................................................................................................ 11
Package Dimensions .................................................................................................................................. 19
FBGA Package Capacitance ......................................................................................................................... 22
Temperature and Thermal Impedance ........................................................................................................ 23
I
I
Truth Tables ............................................................................................................................................... 71
DESELECT ................................................................................................................................................. 75
NO OPERATION (NOP) .............................................................................................................................. 76
LOAD MODE (LM) ..................................................................................................................................... 76
ACTIVATE .................................................................................................................................................. 76
READ ......................................................................................................................................................... 76
WRITE ....................................................................................................................................................... 76
PRECHARGE .............................................................................................................................................. 77
REFRESH ................................................................................................................................................... 77
SELF REFRESH ........................................................................................................................................... 77
Burst Length .............................................................................................................................................. 78
Burst Type ................................................................................................................................................. 79
Operating Mode ......................................................................................................................................... 79
DLL RESET ................................................................................................................................................. 79
Write Recovery ........................................................................................................................................... 80
Power-Down Mode .................................................................................................................................... 80
CAS Latency (CL) ........................................................................................................................................ 81
DLL Enable/Disable ................................................................................................................................... 83
Output Drive Strength ................................................................................................................................ 83
DQS# Enable/Disable ................................................................................................................................. 83
RDQS Enable/Disable ................................................................................................................................. 83
Output Enable/Disable ............................................................................................................................... 83
On-Die Termination (ODT) ........................................................................................................................ 84
DD
DD7
Specifications and Conditions ............................................................................................................... 26
Conditions .......................................................................................................................................... 27
DD
Parameters ........................................................................................................ 26
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
© 2004 Micron Technology, Inc. All rights reserved.