MT47H64M16HR-3 IT:H Micron Technology Inc, MT47H64M16HR-3 IT:H Datasheet - Page 78

• Manufacturer Part Number: MT47H64M16HR-3 IT:H
• Description: DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin FBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H64M16HR-3 IT:H

• Density: 1 Gb
• Maximum Clock Rate: 667 MHz
• Package: 84FBGA
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 0.45 ns
• Operating Temperature: -40 to 85 °C
• Organization: 64Mx16
• Address Bus: 16b
• Access Time (max): 450ps
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 135mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Burst Length
Figure 35: MR Definition
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Notes:
Burst length is defined by bits M0–M2, as shown in Figure 35. Read and write accesses
to the DDR2 SDRAM are burst-oriented, with the burst length being programmable to
either four or eight. The burst length determines the maximum number of column loca-
tions that can be accessed for a given READ or WRITE command.
When a READ or WRITE command is issued, a block of columns equal to the burst
length is effectively selected. All accesses for that burst take place within this block,
meaning that the burst will wrap within the block if a boundary is reached. The block is
uniquely selected by A2–Ai when BL = 4 and by A3–Ai when BL = 8 (where Ai is the most
significant column address bit for a given configuration). The remaining (least signifi-
cant) address bit(s) is (are) used to select the starting location within the block. The
programmed burst length applies to both read and write bursts.
0
BA2
16
M15
1. M16 (BA2) is only applicable for densities ≥1Gb, reserved for future use, and must be
2. Mode bits (Mn) with corresponding address balls (An) greater than M12 (A12) are re-
3. Not all listed WR and CL options are supported in any individual speed grade.
1
0
0
1
1
BA1
15
MR
M14
programmed to “0.”
served for future use and must be programmed to “0.”
14
BA0
M12
0
1
0
1
0
1
0
M11
n
An
Extended mode register (EMR2)
Extended mode register (EMR3)
0
0
0
0
1
1
1
1
Extended mode register (EMR)
(low power)
PD Mode
Slow exit
2
(normal)
PD
Fast exit
Mode Register Definition
12
M10
A12 A11
0
0
1
1
0
0
1
1
Mode register (MR)
11
M9
0
1
0
1
0
1
0
1
WR
10
A10
Write Recovery
9
Reserved
A9
M8
DLL TM
0
1
2
3
4
5
6
7
8
8
A8
M7
DLL Reset
0
1
7
A7 A6 A5 A4 A3
Yes
No
CAS#
Normal
Mode
6
Test
Latency
5
M6
78
0
0
0
0
1
1
1
1
4
M5
BT
0
0
1
1
0
0
1
1
3
M3
0
1
M4
Burst Length
M2
0
1
0
1
0
1
0
1
0
0
0
0
1
1
1
1
2
A2 A1 A0
M1
0
0
1
1
0
0
1
1
1
M0
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0
1
0
1
0
1
0
1
CAS Latency (CL)
Burst Type
Interleaved
Sequential
0
Burst Length
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
3
4
5
6
7
Address Bus
Mode Register (Mx)
4
8
1Gb: x4, x8, x16 DDR2 SDRAM
Mode Register (MR)
© 2004 Micron Technology, Inc. All rights reserved.