MT47H64M16HR-3 IT:H Micron Technology Inc, MT47H64M16HR-3 IT:H Datasheet - Page 25

• Manufacturer Part Number: MT47H64M16HR-3 IT:H
• Description: DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin FBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H64M16HR-3 IT:H

• Density: 1 Gb
• Maximum Clock Rate: 667 MHz
• Package: 84FBGA
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 0.45 ns
• Operating Temperature: -40 to 85 °C
• Organization: 64Mx16
• Address Bus: 16b
• Access Time (max): 450ps
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 135mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Table 7: Thermal Impedance
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Die Revision
G
H
1
1
Package
60-ball
84-ball
60-ball
84-ball
Note:
Substrate
2-layer
4-layer
2-layer
4-layer
2-layer
4-layer
2-layer
4-layer
(pcb)
1. Thermal resistance data is based on a number of samples from multiple lots and should
be viewed as a typical number.
Airflow = 0m/s
θ JA (°C/W)
66.5
49.2
60.2
72.5
54.5
68.8
51.3
44
Electrical Specifications – Absolute Ratings
Airflow = 1m/s
25
θ JA (°C/W)
49.6
40.4
44.5
35.7
55.5
45.7
52.0
42.7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Airflow = 2m/s
1Gb: x4, x8, x16 DDR2 SDRAM
θ JA (°C/W)
43.1
36.4
39.3
32.8
49.5
42.3
46.5
39.6
© 2004 Micron Technology, Inc. All rights reserved.
θ JB (°C/W) θ JC (°C/W)
30.3
26.1
26.1
35.6
35.2
32.5
32.3
30
5.9
5.6
5.7
5.6