MT47H64M16HR-3 IT:H Micron Technology Inc, MT47H64M16HR-3 IT:H Datasheet - Page 88

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MT47H64M16HR-3 IT:H

Manufacturer Part Number
MT47H64M16HR-3 IT:H
Description
DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin FBGA Tray
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H64M16HR-3 IT:H

Density
1 Gb
Maximum Clock Rate
667 MHz
Package
84FBGA
Operating Supply Voltage
1.8 V
Maximum Random Access Time
0.45 ns
Operating Temperature
-40 to 85 °C
Organization
64Mx16
Address Bus
16b
Access Time (max)
450ps
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
Initialization
Figure 42: DDR2 Power-Up and Initialization
DDR2 SDRAM must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in unde-
fined operation. Figure 42 illustrates, and the notes outline, the sequence required for power-up and initialization.
Command
Address
DQS
DM
DQ
V
V
V
ODT
V
V
CK#
CKE
DDQ
DDL
R
TT
CK
REF
DD
15
16
15
15
tt
1
low level 2
LVCMOS
High-Z
High-Z
High-Z
t
VTD 1
T0
t CL
V
clock (CK, CK#)
low level
T = 200µs (MIN) 3
Power-up:
SSTL_18
DD
t CK
and stable
t CL
2
NOP 3
Ta0
T = 400ns (MIN) 4
A10 = 1
Tb0
PRE
t RPA
EMR(2)
LM 5
Code
Tc0
t MRD
EMR(3)
Code
LM 6
Td0
t MRD
Code
LM 7
EMR
Te0
t MRD
DLL RESET
MR with
Code
LM 8
Tf0
t MRD
A10 = 1
PRE 9
Tg0
t RPA
200 cycles of CK are required before a READ command can be issued
REF 10
Th0
t RFC
See no te 10
REF 10
Ti0
t RFC
MR without
DLL RESET
LM 11
Code
Tj0
t MRD
OCD default
EMR with
LM 12
Code
Tk0
Indicates a Break in
Time Scale
t MRD
EMR with
OCD exit
LM 13
Code
Tl0
t MRD
operation
Don’t care
Normal
Valid 14
Valid
Tm0

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