TE28F640J3D75 Intel, TE28F640J3D75 Datasheet - Page 12

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TE28F640J3D75

Manufacturer Part Number
TE28F640J3D75
Description
Manufacturer
Intel
Datasheet

Specifications of TE28F640J3D75

Cell Type
NOR
Density
64Mb
Access Time (max)
75ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
23/22Bit
Operating Supply Voltage (typ)
3/3.3V
Sync/async
Asynchronous
Package Type
TSOP
Program/erase Volt (typ)
2.7 to 3.6V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
8M/4Mword
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
3.0
3.1
Figure 4:
Notes:
1.
2.
3.
Table 1:
Datasheet
12
Package Height
Standoff
Package Body Thickness
Lead Width
Lead Thickness
Package Body Length
Package Body Width
Lead Pitch
Terminal Dimension
Lead Tip Length
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Parameter
56-Lead TSOP Package Mechanical
56-Lead TSOP Dimension Table
Package Information
56-Lead TSOP Package (32, 64, 128 Mbit)
Pin 1
Z
Detail A
Symbol
See Detail A
See Notes 1 and 3
A
A
D
D
A
b
E
e
L
c
1
2
1
L
D
D
1
C
18.200
13.800
19.800
0
0.050
0.965
0.100
0.100
0.500
Min
See Note 2
Millimeters
b
18.400
14.000
Detail B
0.995
0.500
0.150
0.150
20.00
0.600
Nom
A
E
Numonyx™ Embedded Flash Memory (J3 v. D)
18.600
14.200
20.200
A
1.200
1.025
0.200
0.200
0.700
Max
2
Seating
Plane
A
See Detail B
e
1
0.002
0.038
0.004
0.004
0.717
0.543
0.780
0.020
Min
Y
Inches
0.0197
0.039
0.006
0.006
0.724
0.551
0.787
0.024
Nom
November 2007
308551-05
0.047
0.040
0.008
0.008
0.732
0.559
0.795
0.028
Max

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