TE28F640J3D75 Intel, TE28F640J3D75 Datasheet - Page 14

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TE28F640J3D75

Manufacturer Part Number
TE28F640J3D75
Description
Manufacturer
Intel
Datasheet

Specifications of TE28F640J3D75

Cell Type
NOR
Density
64Mb
Access Time (max)
75ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
23/22Bit
Operating Supply Voltage (typ)
3/3.3V
Sync/async
Asynchronous
Package Type
TSOP
Program/erase Volt (typ)
2.7 to 3.6V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
8M/4Mword
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
Table 2:
Notes:
1.
2.
Datasheet
14
Package Body Thickness (256- Mbit)
Ball (Lead) Width
Package Body Width
Package Body Length
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D (32/64/128
Mb)
Corner to Ball A1 Distance Along E (32/64/128
Mb)
For Daisy Chain Evaluation Unit information refer to the Numonyx Flash Memory Packaging Technology Web page at:
www.Numonyx.com/design/packtech/index.htm
For Packaging Shipping Media information refer to the Numonyx Flash Memory Packaging Technology Web page at:
www.Numonyx.com/design/packtech/index.htm
Easy BGA Package Dimensions Table (Sheet 2 of 2)
Parameter
b
D
E
[e]
N
Y
S1
S2
A2
Symb
ol
0.330
9.900
12.900
1.400
2.900
Min
1.000
0.910
0.430
10.000
13.000
64
1.500
3.000
Nom
Millimeters
Numonyx™ Embedded Flash Memory (J3 v. D)
0.530
10.100
13.100
0.100
1.600
3.100
Max
1
1
1
1
Note
s
0.0130
0.3898
0.5079
0.0551
0.1142
Min
0.0358
0.0169
0.3937
0.5118
0.0394
64
0.0591
0.1181
Inches
Nom
November 2007
308551-05
0.0039
0.0209
0.3976
0.5157
0.0630
0.1220
Max

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