TE28F640J3D75 Intel, TE28F640J3D75 Datasheet - Page 68

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TE28F640J3D75

Manufacturer Part Number
TE28F640J3D75
Description
Manufacturer
Intel
Datasheet

Specifications of TE28F640J3D75

Cell Type
NOR
Density
64Mb
Access Time (max)
75ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
23/22Bit
Operating Supply Voltage (typ)
3/3.3V
Sync/async
Asynchronous
Package Type
TSOP
Program/erase Volt (typ)
2.7 to 3.6V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
8M/4Mword
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
Figure 31: Decoder for SCSP Family (256 Mbit Only)
Datasheet
68
Package Designator
RC = 64-Ball Easy BGA, leaded
PC = 64-Ball Easy BGA, lead-free
Group Designator
48F = Flash Memory only
Flash Density
0 = No die
3 = 128-Mbit
Product Family
J = Intel® Embedded Flash Memory
0 = No die
Table 45: Valid Line Item Combinations for SCSP Family
RC48F3300J0Z00S
PC48F3300J0Z00S
R
256-Mbit
C 4
8
F 3 3
0 0
J 0 Z 0
Numonyx™ Embedded Flash Memory (J3 v. D)
0
S
I/O Voltage, CE# Configuration
Z = 3.0 V, Individual Chip
Enable(s)
Parameter, Mux Configuration
0 = No boot Configuration
Ballout Designator
0 = Discrete ballout
Device Details
Third Generation – Character S
thru Z
November 2007
308551-05

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