TMP89xy60UG/FG Toshiba, TMP89xy60UG/FG Datasheet - Page 427

• Manufacturer Part Number: TMP89xy60UG/FG
• Manufacturer: Toshiba

Specifications of TMP89xy60UG/FG

• Package: LQFP64/QFP64
• Rom Types (m=mask,p=otp,f=flash): M/F
• Rom Size: 32/60
• Ram Size: 3K
• Driver Led: 8
• Driver Lcd: -
• Spi/sio Channels: -
• Uart/sio Channels: 2
• I2c/sio Channels: 1
• High-speed Serial Output: -
• Adc 8-bit Channels: -
• Adc 10-bit Channels: 16
• Da Converter Channels: -
• Timer Counter 18-bit Channel: -
• Timer Counter 16-bit Channel: 2
• Timer Counter 8-bit Channel: 4
• Motor Channels: -
• Watchdog Timer: Y
• Dual Clock: Y
• Clock Gear: Y
• Number Of I/o Ports: 58
• Power Supply (v): 4.3 to 5.5

RA004
25.9
25.10
Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these factors
Note 2: The product numbers and specifications of the resonators supplied by Murata Manufacturing Co., Ltd. are subject to
Oscillating Condition
-
-
Handling Precaution
are greatly affected by board patterns, please be sure to evaluate operation on the board on which the device will
actually be mounted.
change.
For up to date information, please refer to the following
http://www.murata.com
The solderability test conditions are shown below.
When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we
recommend electrically shielding the package in order to maintain normal operating condition.
1. When using the Sn-37Pb solder bath
2. When using the Sn-3.0Ag-0.5Cu solder bath
The pass criteron of the above test is as follows: Solderability rate until forming ≥ 95%
Solder bath temperature = 230°C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Solder bath temperature = 245°C
Dipping time = 5 seconds
Number of times = once
R-type flux used
(1) High-frequency oscillation
C
1
XIN
XOUT
C
2
Page 411
(2) Low-frequency oscillation
C
XTIN
1
XTOUT
C
2
TMP89FS60