HD6417720BP133BV Renesas Electronics America, HD6417720BP133BV Datasheet - Page 463

SH3-DSP, WITH USB AND LCDC, PB-F

HD6417720BP133BV

Manufacturer Part Number
HD6417720BP133BV
Description
SH3-DSP, WITH USB AND LCDC, PB-F
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of HD6417720BP133BV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
133MHz
Connectivity
FIFO, I²C, IrDA, MMC, SCI, SD, SIO, SIM, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
117
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
SH7720 Group, SH7721 Group
Section 9 Bus State Controller (BSC)
while the SDRAM waits for the refresh. The LSI asserts the REFOUT pin until the bus mastership
is received. If the slave releases the bus, the LSI acquires the bus mastership to execute the
SDRAM refresh.
The bus release by the BREQ and BACK signal handshaking requires some overhead. If the slave
has many tasks, multiple bus cycles should be executed in a bus mastership acquisition. Reducing
the cycles required for master to slave bus mastership transitions streamlines the system design.
CKIO
BREQ
BACK
A25 to A0
D31 to D0
CSn
Other bus
control signals
Figure 9.45 Bus Arbitration Timing
R01UH0083EJ0400 Rev. 4.00
Page 403 of 1414
Sep 21, 2010

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