MPC8360EVVALFHA Freescale Semiconductor, MPC8360EVVALFHA Datasheet - Page 106

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MPC8360EVVALFHA

Manufacturer Part Number
MPC8360EVVALFHA
Description
IC MPU POWERQUICC II PRO 740TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheet

Specifications of MPC8360EVVALFHA

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
667MHz
Voltage
1.3V
Mounting Type
Surface Mount
Package / Case
740-TBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
667MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
TBGA
No. Of Pins
740
Rohs Compliant
Yes
Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
667MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.3V
Operating Supply Voltage (max)
1.35V
Operating Supply Voltage (min)
1.25V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
740
Package Type
TBGA
For Use With
MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8360EVVALFHA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8360EVVALFHA
Manufacturer:
FREESCALE
Quantity:
20 000
1
2
3
Ordering Information
pull-up/pull-down resistors coupled with the large value of the pull-up/pull-down resistor should minimize
the disruption of signal quality or speed for output pins thus configured.
24.7
The device requires high resistance pull-up resistors (10 kΩ is recommended) on open drain type pins
including I
For more information on required pull-up resistors and the connections required for the JTAG interface,
see MPC8360E/MPC8358E PowerQUICC Design Checklist (AN3097).
25 Ordering Information
25.1
Table 80
individual part numbers correspond to a maximum processor core frequency. For available frequencies,
contact your local Freescale sales office. In addition to the processor frequency, the part numbering scheme
also includes an application modifier, which may specify special application conditions. Each part number
also contains a revision code that refers to the die mask revision number.
106
Product
(rev. 2.0
MPC nnnn
silicon
Code
MPC
MPC
only)
Not all processor, platform, and QUICC Engine block frequency combinations are supported. For available frequency
combinations, contact your local Freescale sales office or authorized distributor.
See
Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification
support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core
frequencies.
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
Section 21, “Package and Pin Listings,”
Identifier
provides the Freescale part numbering nomenclature for the MPC8360E/58E. Note that the
Pull-Up Resistor Requirements
Part Numbers Fully Addressed by this Document
8358
8360
8360
Part
2
C pins, Ethernet Management MDIO pin, and EPIC interrupt pins.
Acceleration
E = included
E = included
Encryption
Blank = not
Blank = not
included
included
e
Temperature
C= –40°C T
Blank = 0°C
T
to 105°C T
A
0°C T
Table 80. Part Numbering Nomenclature
70°C T
Range
to 105°C
T
t
J
A
to
for more information on available package types.
J
J
A
ZU = TBGA
VV = TBGA
(no lead)
ZU = TBGA
VV = TBGA
(no lead)
Package
pp
2
e300 core speed
e300 core speed
e300 core speed
AD = 266 MHz
AG = 400 MHz
AG = 400 MHz
AH = 500 MHz
AJ = 533 MHz
AL = 667 MHz
AL = 667 MHz
Frequency
Processor
aa
3
D = 266 MHz E = 300 MHz
D = 266 MHz
F = 333 MHz
F = 333 MHz G = 400 MHz
Frequency
Platform
1
a
G = 400 MHz
G = 400 MHz
H = 500 MHz
H = 500 MHz
Frequency
Freescale Semiconductor
Engine
QUICC
a
A = rev. 2.1
A = rev. 2.1
Revision
silicon
silicon
Die
A

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