MPC8360EVVALFHA Freescale Semiconductor, MPC8360EVVALFHA Datasheet - Page 77

• Manufacturer Part Number: MPC8360EVVALFHA
• Description: IC MPU POWERQUICC II PRO 740TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8360EVVALFHA

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 667MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 740-TBGA
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 667MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 740
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 667MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3V
• Operating Supply Voltage (max): 1.35V
• Operating Supply Voltage (min): 1.25V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 740
• Package Type: TBGA
• For Use With: MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

Table 67
Freescale Semiconductor
NC
Notes:
1. This pin is an open drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to OV
2. This pin is an open drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OV
3. This output is actively driven during reset rather than being three-stated during reset.
4. These JTAG pins have weak internal pull-up P-FETs that are always enabled.
5. This pin should have a weak pull up if the chip is in PCI host mode. Follow PCI specifications recommendation.
6. These are On Die Termination pins, used to control DDR2 memories internal termination resistance
7. This pin must always be tied to GND.
8. This pin must always be left not connected.
9. Refers to MPC8360E PowerQUICC II Pro Integrated Communications Processor Family Reference Manual section on
10. It is recommended that MDIC0 be tied to GND using an 18.2 Ω resistor and MDIC1 be tied to DDR power using an 18.2 Ω
MEMC1_MDQ[0:63]
MEMC_MECC[0:4]/MSRCID[0:4]
MEMC_MECC[5]/MDVAL
MEMC_MECC[6:7]
MEMC_MDM[0:8]
MEMC_MDQS[0:8]
MEMC_MBA[0:1]
MEMC_MBA[2]
MEMC_MA[0:14]
“RGMII Pins,” for information about the two UCC2 Ethernet interface options.
resistor for DDR2.
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
shows the pin list of the MPC8358E TBGA package.
Signal
Signal
Table 66. MPC8360E TBGA Pinout Listing (continued)
Table 67. MPC8358E TBGA Pinout Listing
AM20, AU19
AJ34, AK33, AL33, AL35, AJ33, AK34, AK32,
AM36, AN37, AN35, AR34, AT34, AP37, AP36,
AR36, AT35, AP34, AR32, AP32, AM31, AN33,
AM34, AM33, AM30, AP31, AM27, AR30, AT32,
AN29, AP29, AN27, AR29, AN8, AN7, AM8, AM6,
AP9, AN9, AT7, AP7, AU6, AP6, AR4, AR3, AT6,
AT5, AR5, AT3, AP4, AM5, AP3, AN3, AN5, AL5,
AN4, AM2, AL2, AH5, AK3, AJ2, AJ3, AH4, AK4,
AH3
AP24, AN22, AM19, AN19, AM24
AM23
AM22, AN18
AL36, AN34, AP33, AN28,AT9, AU4, AM3,
AJ6,AP27
AK35, AP35, AN31, AM26,AT8, AU3, AL4, AJ5,
AP26
AU29, AU30
AT30
AU21, AP22, AP21, AT21, AU25, AU26, AT23,
AR26, AU24, AR23, AR28, AU23, AR22, AU20,
AR18
DDR SDRAM Memory Controller Interface
Package Pin Number
Package Pin Number
No Connect
Pin Type
Pin Type
I/O
I/O
I/O
I/O
I/O
—
O
O
O
O
DD
Package and Pin Listings
DD
.
Supply
Supply
Power
Power
GV
GV
GV
GV
GV
GV
GV
GV
GV
—
DD
DD
DD
DD
DD
DD
DD
DD
DD
Notes
Notes
—
—
—
—
—
—
—
—
—
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