MPC8360EVVALFHA Freescale Semiconductor, MPC8360EVVALFHA Datasheet - Page 54

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MPC8360EVVALFHA

Manufacturer Part Number
MPC8360EVVALFHA
Description
IC MPU POWERQUICC II PRO 740TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheet

Specifications of MPC8360EVVALFHA

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
667MHz
Voltage
1.3V
Mounting Type
Surface Mount
Package / Case
740-TBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
667MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
TBGA
No. Of Pins
740
Rohs Compliant
Yes
Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
667MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.3V
Operating Supply Voltage (max)
1.35V
Operating Supply Voltage (min)
1.25V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
740
Package Type
TBGA
For Use With
MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8360EVVALFHA
Manufacturer:
Freescale Semiconductor
Quantity:
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Part Number:
MPC8360EVVALFHA
Manufacturer:
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Quantity:
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PCI
12 PCI
This section describes the DC and AC electrical specifications for the PCI bus of the MPC8360E/58E.
12.1
Table 46
12.2
This section describes the general AC timing parameters of the PCI bus of the device. Note that the
PCI_CLK or PCI_SYNC_IN signal is used as the PCI input clock depending on whether the device is
configured as a host or agent device.
54
High-level input voltage
Low-level input voltage
High-level output voltage
Low-level output voltage
Input current
Note:
1. Note that the symbol V
Clock to output valid
Output hold from clock
Clock to output high impedance
Input setup to clock
Input hold from clock
Notes:
1. The symbols used for timing specifications follow the pattern of t
2. See the timing measurement conditions in the PCI 2.2 Local Bus Specifications .
3. For purposes of active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered
4. Input timings are measured at the pin.
5. In rev. 2.0 silicon, due to errata, t
6. In rev. 2.0 silicon, due to errata, t
.
inputs and t
(PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, t
(K) going to the high (H) state or setup time. Also, t
(R) went high (H) relative to the frame signal (F) going to the valid (V) state.
through the component pin is less than or equal to the leakage current specification.
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
provides the DC electrical characteristics for the PCI interface of the device.
PCI DC Electrical Characteristics
PCI AC Electrical Specifications
(first two letters of functional block)(reference)(state)(signal)(state)
Parameter
IN
Parameter
, in this case, represents the OV
Table 47. PCI AC Timing Specifications at 66 MHz
PCIHOV
PCIXKH
Table 46. PCI DC Electrical Characteristics
maximum is 6.6 ns. Refer to Errata PCI21 in Chip Errata for the MPC8360E, Rev. 1 .
minimum is 1 ns. Refer to Errata PCI17 in Chip Errata for the MPC8360E, Rev. 1 .
Table 47
Symbol
V
V
V
V
I
OH
IN
OL
IH
IL
PCRHFV
provides the PCI AC timing specifications at 66 MHz.
IN
symbolizes PCI timing (PC) with respect to the time hard reset
V
symbol referenced in
0 V ≤ V
V
OUT
Test Condition
OUT
I
I
OH
OL
Symbol
t
t
t
t
t
PCKHOV
PCKHOX
PCKHOZ
PCIVKH
PCIXKH
(first two letters of functional block)(signal)(state)(reference)(state)
≥ V
for outputs. For example, t
= 1500 μA
≤ V
= –500 μA
IN
OH
1
OL
≤ OV
1
(min) or
(max)
DD
Min
3.0
0.3
Table 1
1
0.5 × OV
0.9 × OV
Min
-0.5
and
PCIVKH
Table
DD
DD
Max
6.0
14
Freescale Semiconductor
symbolizes PCI timing
2.
OV
0.3 × OV
0.1 × OV
DD
Max
±10
Unit
+ 0.5
ns
ns
ns
ns
ns
SYS
DD
DD
, reference
Notes
2, 4, 6
2, 5
2, 3
2, 4
Unit
2
μA
for
V
V
V
V

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