MPC8360EVVALFHA Freescale Semiconductor, MPC8360EVVALFHA Datasheet - Page 14

• Manufacturer Part Number: MPC8360EVVALFHA
• Description: IC MPU POWERQUICC II PRO 740TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8360EVVALFHA

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 667MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 740-TBGA
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 667MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 740
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 667MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3V
• Operating Supply Voltage (max): 1.35V
• Operating Supply Voltage (min): 1.25V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 740
• Package Type: TBGA
• For Use With: MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

Power Characteristics
14
Notes:
1. The values do not include I/O supply power (OV
2. Typical power is based on a voltage of V
3. Thermal solutions will likely need to design to a value higher than typical power on the end application, T
4. Maximum power is based on a voltage of V
5. Maximum power is based on a voltage of V
6. Typical power is based on a voltage of V
7. Maximum power is based on a voltage of V
8. This frequency combination is only available for rev. 2.0 silicon.
9. This frequency combination is not available for rev. 2.0 silicon.
Notes:
1. The values do not include I/O supply power (OV
2. Typical power is based on a voltage of V
3. Thermal solutions will likely need to design to a value higher than typical power on the end application, T
4. Maximum power is based on a voltage of V
application.
power.
a junction T
application.
a junction T
application.
power.
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
Frequency (MHz)
Frequency (MHz)
Core
Core
667
266
400
J
J
= 105°C, and an artificial smoke test.
= 70°C, and an artificial smoke test.
Table 4. MPC8360E TBGA Core Power Dissipation
Frequency (MHz)
Frequency (MHz)
Table 5. MPC8358E TBGA Core Power Dissipation
CSB
CSB
333
266
266
DD
DD
DD
= 1.2 V or 1.3 V, a junction temperature of T
DD
DD
DD
DD
= 1.3 V, a junction temperature of T
= 1.2 V, a junction temperature of T
= 1.3 V for applications that use 667 MHz (CPU) or 500 (QE) with WC process,
= 1.3 V for applications that use 667 MHz (CPU)/500 (QE) with WC process,
= 1.2 V, WC process, a junction T
= 1.2 V, WC process, a junction T
DD
DD
, LV
, LV
Frequency (MHz)
Frequency (MHz)
QUICC Engine
QUICC Engine
DD
DD
, GV
, GV
500
300
400
DD
DD
) or AV
) or AV
DD
DD
. For I/O power values, see
. For I/O power values, see
Typical
Typical
6.1
4.1
4.5
J
J
J
J
= 70°C, and a Dhrystone benchmark
= 105°C, and a Dhrystone benchmark
= 105°C, and an artificial smoke test.
= 105°C, and an artificial smoke test.
1
(continued)
J
= 105°C, and a Dhrystone benchmark
1
Maximum
Maximum
6.8
4.5
5.0
Freescale Semiconductor
Table
Table
A
A
Unit
Unit
target, and I/O
target, and I/O
W
W
W
6.
6.
2, 3, 5, 9
Notes
Notes
2, 3, 4
2, 3, 4