MPC8360EVVALFHA Freescale Semiconductor, MPC8360EVVALFHA Datasheet - Page 61

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MPC8360EVVALFHA

Manufacturer Part Number
MPC8360EVVALFHA
Description
IC MPU POWERQUICC II PRO 740TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheet

Specifications of MPC8360EVVALFHA

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
667MHz
Voltage
1.3V
Mounting Type
Surface Mount
Package / Case
740-TBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
667MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
TBGA
No. Of Pins
740
Rohs Compliant
Yes
Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
667MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.3V
Operating Supply Voltage (max)
1.35V
Operating Supply Voltage (min)
1.25V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
740
Package Type
TBGA
For Use With
MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8360EVVALFHA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8360EVVALFHA
Manufacturer:
FREESCALE
Quantity:
20 000
17.2
Table 58
Figure 44
Figure 45
reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the
active edge.
Freescale Semiconductor
Input low voltage
Input current
TDM/SI outputs—External clock delay
TDM/SI outputs—External clock high impedance
TDM/SI inputs—External clock input setup time
TDM/SI inputs—External clock input hold time
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings
2. The symbols used for timing specifications follow the pattern of t
3. Timings are measured from the positive or negative edge of the clock, according to SIxMR [CE] and SITXCEI[TXCEIx]. See
are measured at the pin.
inputs and t
outputs external timing (SE) for the time t
are invalid (X).
the MPC8360E Integrated Communications Processor Family Reference Manual for more details.
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
provides the TDM/SI input and output AC timing specifications.
TDM/SI AC Timing Specifications
provides the AC test load for the TDM/SI.
represents the AC timing from
(first two letters of functional block)(reference)(state)(signal)(state)
Characteristic
Output
Characteristic
Table 57. TDM/SI DC Electrical Characteristics (continued)
Table 58. TDM/SI AC Timing Specifications
TDM/SI
Figure 44. TDM/SI AC Test Load
Symbol
Z
Table
0
V
memory clock reference (K) goes from the high state (H) until outputs (O)
I
= 50 Ω
IN
IL
56. Note that although the specifications generally
0 V ≤ V
Condition
(first two letters of functional block)(signal)(state)(reference)(state)
for outputs. For example, t
IN
≤ OV
Symbol
t
t
t
t
SEKHOV
SEKHOX
SEIVKH
SEIXKH
R
DD
L
= 50 Ω
2
1
–0.3
Min
OV
Min
2
2
5
2
SEKHOX
DD
/2
symbolizes the TDM/SI
Max
±10
Max
0.8
10
10
3
Unit
Unit
TDM/SI
μA
ns
ns
ns
ns
for
V
61

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