MPC8360EVVALFHA Freescale Semiconductor, MPC8360EVVALFHA Datasheet - Page 23

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MPC8360EVVALFHA

Manufacturer Part Number
MPC8360EVVALFHA
Description
IC MPU POWERQUICC II PRO 740TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheet

Specifications of MPC8360EVVALFHA

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
667MHz
Voltage
1.3V
Mounting Type
Surface Mount
Package / Case
740-TBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
667MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
TBGA
No. Of Pins
740
Rohs Compliant
Yes
Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
667MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.3V
Operating Supply Voltage (max)
1.35V
Operating Supply Voltage (min)
1.25V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
740
Package Type
TBGA
For Use With
MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8360EVVALFHA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8360EVVALFHA
Manufacturer:
FREESCALE
Quantity:
20 000
Figure 6
6.2.2
Table 21
DDR and DDR2 SDRAM interface.
Freescale Semiconductor
At recommended operating conditions with GV
At recommended operating conditions with GV
MDQS—MDQ/MECC input skew per byte
Notes:
1. AC timing values are based on the DDR data rate, which is twice the DDR memory bus frequency.
2. Maximum possible skew between a data strobe (MDQS[n]) and any corresponding bit of data (MDQ[8n + {0...7}] if 0 ≤ n ≤ 7)
MCK[n] cycle time, (MCK[n]/MCK[n] crossing)
Skew between any MCK to ADDR/CMD
or ECC (MECC[{0...7}] if n = 8).
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
MDQS[n]
MDQ[x]
shows the input timing diagram for the DDR controller.
and
MCK[n]
MCK[n]
DDR and DDR2 SDRAM Output AC Timing Specifications
Table 22
Table 21. DDR and DDR2 SDRAM Output AC Timing Specifications for Source
Parameter
Table 20. DDR and DDR2 SDRAM Input AC Timing Specifications Mode
Parameter
provide the output AC timing specifications and measurement conditions for the
8
333 MHz
266 MHz
200 MHz
DD
DD
Figure 6. DDR Input Timing Diagram
of (1.8 or 2.5 V) ± 5%.
of (1.8 V or 2.5 V) ± 5%.
333 MHz
266 MHz
200 MHz
t
t
MCK
Symbol
DISKEW
t
DISKEW
Synchronous Mode
Symbol
t
AOSKEW
t
MCK
1
D0
–1125
–1250
–750
Min
D1
–1.0
–1.1
–1.2
Min
6
t
DISKEW
1125
1250
Max
750
Max
0.2
0.3
0.4
10
DDR and DDR2 SDRAM
Unit
ps
Unit
ns
ns
Notes
Notes
1, 2
2
3
23

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