MPC8360EVVALFHA Freescale Semiconductor, MPC8360EVVALFHA Datasheet - Page 97

• Manufacturer Part Number: MPC8360EVVALFHA
• Description: IC MPU POWERQUICC II PRO 740TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8360EVVALFHA

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 667MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 740-TBGA
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 667MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 740
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 667MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3V
• Operating Supply Voltage (max): 1.35V
• Operating Supply Voltage (min): 1.25V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 740
• Package Type: TBGA
• For Use With: MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

23 Thermal
This section describes the thermal specifications of the MPC8360E/58E.
23.1
Table 77
Freescale Semiconductor
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (@1 m/s) on single-layer board (1s)
Junction-to-ambient (@ 1 m/s) on four-layer board (2s2p)
Junction-to-ambient (@ 2 m/s) on single-layer board (1s)
Junction-to-ambient (@ 2 m/s) on four-layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Index
A
B
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
•
•
Example A. To configure the device with CSB clock rate of 266 MHz, core rate of 400 MHz, and
QUICC Engine clock rate 300 MHz while the input clock rate is 33 MHz. Conf No. ‘s10’ and ‘c1’
are selected from
is 0.
Example B. To configure the device with CSBCSB clock rate of 266 MHz, core rate of 533 MHz
and QUICC Engine clock rate 400 MHz while the input clock rate is 66 MHz. Conf No. ‘s5h’ and
‘c2h’ are selected from
CEPDF is 0.
SPMF
1000
0100
provides the package thermal characteristics for the 37.5 mm × 37.5 mm 740-TBGA package.
Thermal Characteristics
0000011
0000100
CORE
PLL
Table 77. Package Thermal Characteristics for the TBGA Package
CEPMF CEPDF
Table
01001
00110
Characteristic
Table
76. SPMF is 1000, CORPLL is 0000011, CEPMF is 01001, and CEPDF
0
0
76. SPMF is 0100, CORPLL is 0000100, CEPMF is 00110, and
Example 1. Sample Table Use
Input Clock
(MHz)
33
66
CSB Freq
(MHz)
266
266
Core Freq
(MHz)
400
533
Symbol
R
R
R
R
R
R
R
R
θJMA
θJMA
θJMA
θJMA
θJC
θJA
θJA
θJB
Engine Freq
QUICC
(MHz)
300
400
Value
4.5
1.1
15
11
10
8
9
7
(MHz)
400
∞
∞
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
(MHz)
533
∞
∞
Notes
Thermal
(MHz)
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
667
4
5
∞
∞
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