MPC8360EVVALFHA Freescale Semiconductor, MPC8360EVVALFHA Datasheet - Page 29

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MPC8360EVVALFHA

Manufacturer Part Number
MPC8360EVVALFHA
Description
IC MPU POWERQUICC II PRO 740TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheet

Specifications of MPC8360EVVALFHA

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
667MHz
Voltage
1.3V
Mounting Type
Surface Mount
Package / Case
740-TBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
667MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
TBGA
No. Of Pins
740
Rohs Compliant
Yes
Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
667MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.3V
Operating Supply Voltage (max)
1.35V
Operating Supply Voltage (min)
1.25V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
740
Package Type
TBGA
For Use With
MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8360EVVALFHA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8360EVVALFHA
Manufacturer:
FREESCALE
Quantity:
20 000
8.2
The AC timing specifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.
8.2.1
This sections describe the GMII transmit and receive AC timing specifications.
8.2.1.1
Table 27
Freescale Semiconductor
At recommended operating conditions with LV
Supply voltage 3.3 V
Output high voltage
Output low voltage
Input high voltage
Input low voltage
Input current
Note:
1. GMII/MII pins that are not needed for RGMII, RMII, or RTBI operation are powered by the OV
Supply voltage 2.5 V
Output high voltage
Output low voltage
Input high voltage
Input low voltage
Input current
GTX_CLK clock period
GTX_CLK duty cycle
GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay
GTX_CLK clock rise time, (20% to 80%)
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
Table 25. RGMII/RTBI, GMII, TBI, MII, and RMII DC Electrical Characteristics (when operating at 3.3 V)
Parameter
provides the GMII transmit AC timing specifications.
GMII, MII, RMII, TBI, RGMII, and RTBI AC Timing Specifications
Parameters
GMII Timing Specifications
GMII Transmit AC Timing Specifications
Table 26. RGMII/RTBI DC Electrical Characteristics (when operating at 2.5 V)
Parameter/Condition
Symbol
LV
V
V
V
V
I
Table 27. GMII Transmit AC Timing Specifications
OH
IN
OL
IH
DD
IL
DD
Symbol
/OV
I
LV
OH
V
V
I
V
V
OL
I
OH
IN
OL
DD
IH
IL
DD
= –4.0 mA
= 4.0 mA
of 3.3 V ± 10%.
0 V ≤ V
Conditions
I
OH
I
OL
= –1.0 mA
IN
= 1.0 mA
≤ LV
0 V ≤ V
t
LV
LV
Symbol
GTXH/tGTX
t
t
GTKHDX
GTKHDV
UCC Ethernet Controller: Three-Speed Ethernet, MII Management
Conditions
t
DD
DD
DD
t
GTXR
GTX
= Min
= Min
IN
1
≤ LV
LV
LV
LV
LV
DD
DD
DD
DD
DD
Min
= Min
= Min
= Min
= Min
0.5
40
GND
2.97
2.40
–0.3
Min
2.0
Typ
GND – 0.3
8.0
2.37
2.00
–0.3
LV
LV
Min
1.7
DD
DD
DD
Max
3.63
0.50
0.90
±10
supply.
+ 0.3
+ 0.3
Max
5.0
1.0
60
LV
LV
DD
DD
Max
2.63
0.40
0.70
±10
Unit
μA
V
V
V
V
V
+ 0.3
+ 0.3
Unit
ns
ns
ns
%
Notes
Notes
Unit
1
μA
V
V
V
V
V
3
29

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