MPC8360EVVALFHA Freescale Semiconductor, MPC8360EVVALFHA Datasheet - Page 107

• Manufacturer Part Number: MPC8360EVVALFHA
• Description: IC MPU POWERQUICC II PRO 740TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8360EVVALFHA

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 667MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 740-TBGA
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 667MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 740
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 667MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3V
• Operating Supply Voltage (max): 1.35V
• Operating Supply Voltage (min): 1.25V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 740
• Package Type: TBGA
• For Use With: MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

Table 81
26 Document Revision History
Table 82
Freescale Semiconductor
Number
Rev.
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
4
3
2
01/2011
03/2010
12/2007 Initial release.
shows the SVR settings by device and package type.
provides a revision history for this hardware specification.
Date
• Updated references to the LCRR register throughout
• Removed references to DDR DLL mode in
• Changed “Junction-to-Case” to “Junction-to-Ambient” in
• Changed references to RCWH[PCICKEN] to RCWH[PCICKDRV].
• In
• Added
• In
• Updated the title of
• In
• In
• In
• In
• In
• In
• Added
• Updated
• In
• In
• In
• In
Specifications.”
Junction-to-Ambient Thermal
Resistance of TBGA Package,” titles.
removed watermark.
20–80% and 80–20% of the voltage supply, respectively.
note 7: “This pin must always be tied to GND” to the TEST pin and added a note to SPARE1 stating: “This
pin must always be left not connected.”
PowerQUICC Design Checklist,’ for proper pin termination and usage.”
or CLKIN/2 is driven out on the PCI_CLK_OUTn signals.”
Section 4, “Clock Input
Table
Table
Table 27–Table
Table 38,
Table
Table
Section 21.3, “Pinout
Section 22,
Section 22.1, “System PLL
Table
Figure
MPC8360E
MPC8360
MPC8358E
MPC8358
Figure
Section 4.3, “Gigabit Reference Clock Input
2, added extended temperature characteristics.
20, “DDR and DDR2 SDRAM Input AC Timing Specifications Mode,” changed table subtitle.
45, “I2C AC Electrical Specifications,” changed units to “ns” for t
66, “MPC8360E TBGA Pinout Listing,” and
80, added extended temperature characteristics.
Section 8.1.1, “10/100/1000 Ethernet DC Electrical
Device
53, “Mechanical Dimensions and Bottom Surface Nomenclature of the TBGA Package,”
“IEEE 1588 Timer AC Specifications,” changed first parameter to “Timer clock frequency.”
6, “DDR Input Timing Diagram.”
“Clocking,” removed statement: “The OCCR[PCICDn] parameters select whether CLKIN
30, and
Table
Package
Listings,” added sentence stating “Refer to AN3097, ‘MPC8360/MPC8358E
Table 82. Revision History
TBGA
TBGA
TBGA
TBGA
Timing,” added note regarding rise/fall time on QUICC Engine block input pins.
19,”DDR SDRAM Input AC Timing Specifications.”
Table 33—Table
Table 81. SVR Settings
Resistance,” and
Configuration,” updated the system VCO frequency conditions.
0x804A_0020
0x804B_0020
0x8048_0020
0x8049_0020
Substantive Change(s)
(Rev. 2.0)
SVR
Section 6.2.2, “DDR and DDR2 SDRAM Output AC Timing
34, changed the rise and fall time specifications to reference
Table
Timing.”
Table 67
78, “Heat Sinks and Junction-to-Ambient Thermal
Section 23.2.4, “Heat Sinks and
0x804A_0021
0x804B_0021
0x8048_0021
0x8049_0021
(Rev. 2.1)
Characteristics.”
“MPC8358E TBGA Pinout
SVR
I2DVKH
Document Revision History
.
Listing,
added
107