PIC16F716-I/P Microchip Technology Inc., PIC16F716-I/P Datasheet - Page 60

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PIC16F716-I/P

Manufacturer Part Number
PIC16F716-I/P
Description
18 PIN, 3.5 KB FLASH, 128 RAM, 13 I/O
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC16F716-I/P

A/d Inputs
4-Channel, 8-Bit
Cpu Speed
5 MIPS
Eeprom Memory
0 Bytes
Input Output
13
Memory Type
Flash
Number Of Bits
8
Package Type
18-pin PDIP
Programmable Memory
3.5K Bytes
Ram Size
128 Bytes
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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PIC16F716
9.2.3
For timing insensitive applications, the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the
resistor (R
operating temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal
process
difference in lead frame capacitance between package
types will also affect the oscillation frequency,
especially for low C
take into account variation due to tolerance of external
R and C components used. Figure 9-3 shows how the
R/C combination is connected to the PIC16F716.
FIGURE 9-3:
9.3
The PIC16F716 differentiates between various kinds of
Reset:
• Power-on Reset (POR)
• MCLR Reset during normal operation
• MCLR Reset during Sleep
• WDT Reset (during normal operation)
• WDT Wake-up (during Sleep)
• Brown-out Reset (BOR)
Some registers are not affected in any Reset condition;
their status is unknown on POR and unchanged in any
other Reset. Most other registers are reset to a “Reset
state” on Power-on Reset (POR), on the MCLR and
WDT Reset, on MCLR Reset during Sleep and Brown-
out Reset (BOR). They are not affected by a WDT
Wake-up, which is viewed as the resumption of normal
operation. The TO and PD bits are set or cleared differ-
ently in different Reset situations as indicated in
Table 9-4. These bits are used in software to determine
the nature of the Reset. See Table 9-6 for a full
description of Reset states of all registers.
DS41206A-page 58
Recommended values:
3 k
10 k
C
C
V
R
EXT
EXT
SS
EXT
V
DD
R
20 pF
R
Reset
EXT
EXT
parameter
EXT
RC OSCILLATOR
) and capacitor (C
100 k
F
100 k
OSC
EXT
/4
V
RC OSCILLATOR MODE
V
OSC1
variation.
values. The user also needs to
DD
OSC2/CLKOUT
DD
V
V
EXT
Furthermore,
) values and the
PIC16F716
Internal
clock
Preliminary
the
A simplified block diagram of the On-chip Reset circuit
is shown in Figure 9-5.
The PICmicro
filter in the MCLR Reset path. The filter will detect and
ignore small pulses.
It should be noted that a WDT Reset does not drive the
MCLR pin low.
9.4
A Power-on Reset pulse is generated on-chip when
V
just tie the MCLR pin directly (or through a resistor) to
V
usually needed to create a Power-on Reset. A
maximum rise time for V
D004). For a slow rise time, see Figure 9-4.
When the device starts normal operation (exits the
Reset
(voltage, frequency, temperature,...) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met. Brown-out Reset may be used to
meet the start-up conditions.
FIGURE 9-4:
DD
DD
Note 1:
. This will eliminate external RC components
rise is detected. To take advantage of the POR,
2:
3:
condition),
Power-On Reset (POR)
External Power-on Reset circuit is required
only if V
diode D helps discharge the capacitor quickly
when V
R < 40 k is recommended to make sure that
voltage drop across R does not violate the
device’s electrical specification.
R1 = 100
flowing into MCLR from external capacitor C
in the event of MCLR/V
to Electrostatic Discharge (ESD) or Electrical
Overstress
®
microcontrollers have an MCLR noise
V
DD
R
DD
DD
C
V
device
powers down.
power-up slope is too slow. The
DD
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW V
to 1 k
(EOS).
 2003 Microchip Technology Inc.
DD
R1
will limit any current
is specified (parameter
operating
DD
PP
PIC16F716
MCLR
pin breakdown due
POWER-UP)
parameters

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