PIC18F6621-I/PT Microchip Technology Inc., PIC18F6621-I/PT Datasheet - Page 6

• Manufacturer Part Number: PIC18F6621-I/PT
• Description: 64 PIN, 64 KB FLASH, 3840 RAM, 52 I/O
• Manufacturer: Microchip Technology Inc.

Specifications of PIC18F6621-I/PT

• A/d Inputs: 12-Channel, 10-Bit
• Comparators: 2
• Cpu Speed: 10 MIPS
• Eeprom Memory: 1024 Bytes
• Input Output: 54
• Interface: I2C/SPI/UART/USART
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 64-pin TQFP
• Programmable Memory: 64K Bytes
• Ram Size: 3.8K Bytes
• Speed: 40 MHz
• Timers: 2-8-bit, 3-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PIC18F6525/6621/8525/8621
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 103
11.0 Timer0 Module ......................................................................................................................................................................... 131
12.0 Timer1 Module ......................................................................................................................................................................... 135
13.0 Timer2 Module ......................................................................................................................................................................... 141
14.0 Timer3 Module ......................................................................................................................................................................... 143
15.0 Timer4 Module ......................................................................................................................................................................... 147
16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 149
17.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 157
18.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 173
19.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 213
20.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 233
21.0 Comparator Module.................................................................................................................................................................. 243
22.0 Comparator Voltage Reference Module ................................................................................................................................... 249
23.0 Low-Voltage Detect .................................................................................................................................................................. 253
24.0 Special Features of the CPU .................................................................................................................................................... 259
25.0 Instruction Set Summary .......................................................................................................................................................... 275
26.0 Development Support............................................................................................................................................................... 317
27.0 Electrical Characteristics .......................................................................................................................................................... 323
28.0 DC and AC Characteristics Graphs And Tables ...................................................................................................................... 357
29.0 Packaging Information.............................................................................................................................................................. 373
Appendix A: Revision History............................................................................................................................................................. 377
Appendix B: Device Differences......................................................................................................................................................... 377
Appendix C: Conversion Considerations ........................................................................................................................................... 378
Appendix D: Migration From Mid-Range to Enhanced Devices......................................................................................................... 378
Appendix E: Migration From High-End to Enhanced Devices............................................................................................................ 379
Index .................................................................................................................................................................................................. 381
On-Line Support................................................................................................................................................................................. 391
Systems Information and Upgrade Hot Line ...................................................................................................................................... 391
Reader Response .............................................................................................................................................................................. 392
PIC18F6525/6621/8525/8621 Product Identification System ............................................................................................................ 393
DS39612B-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 21
Reset .......................................................................................................................................................................................... 29
Memory Organization ................................................................................................................................................................. 39
Flash Program Memory .............................................................................................................................................................. 61
External Memory Interface ......................................................................................................................................................... 71
Data EEPROM Memory ............................................................................................................................................................. 79
8 x 8 Hardware Multiplier............................................................................................................................................................ 85
Interrupts .................................................................................................................................................................................... 87
 2005 Microchip Technology Inc.