PIC16F887-I/PT Microchip Technology Inc., PIC16F887-I/PT Datasheet - Page 268

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PIC16F887-I/PT

Manufacturer Part Number
PIC16F887-I/PT
Description
MCU, 8-Bit, 8KW Flash, 368 RAM, 36 I/O, TQFP-44
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC16F887-I/PT

A/d Inputs
14-Channel, 10-Bit
Comparators
2
Cpu Speed
5 MIPS
Eeprom Memory
256 Bytes
Frequency
20 MHz
Input Output
35
Interface
I2C/SPI/USART
Memory Type
Flash
Number Of Bits
8
Package Type
44-pin TFQP
Programmable Memory
14K Bytes
Ram Size
368 Bytes
Resistance, Drain To Source On
Bytes
Serial Interface
MSSP or EUSART
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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PIC16F882/883/884/886/887
DS41291D-page 266
28-Lead Plastic Small Outline (SO or OI) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
Preliminary
Units
A2
E1
A1
E1
A2
L1
N
A
E
D
α
e
h
L
φ
c
b
β
α
E
2.05
0.10
0.25
0.40
0.18
0.31
MIN
φ
L1
L
MILLIMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
Microchip Technology Drawing C04-052B
h
© 2007 Microchip Technology Inc.
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
β
c

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