PIC16F887-I/PT Microchip Technology Inc., PIC16F887-I/PT Datasheet - Page 269

• Manufacturer Part Number: PIC16F887-I/PT
• Description: MCU, 8-Bit, 8KW Flash, 368 RAM, 36 I/O, TQFP-44
• Manufacturer: Microchip Technology Inc.

Specifications of PIC16F887-I/PT

• A/d Inputs: 14-Channel, 10-Bit
• Comparators: 2
• Cpu Speed: 5 MIPS
• Eeprom Memory: 256 Bytes
• Frequency: 20 MHz
• Input Output: 35
• Interface: I2C/SPI/USART
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 44-pin TFQP
• Programmable Memory: 14K Bytes
• Ram Size: 368 Bytes
• Resistance, Drain To Source On: Bytes
• Serial Interface: MSSP or EUSART
• Speed: 20 MHz
• Timers: 2-8-bit, 1-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

© 2007 Microchip Technology Inc.
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
PIC16F882/883/884/886/887
e
Preliminary
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
A2
E
MIN
1.65
0.05
7.40
5.00
9.90
0.55
0.09
0.22
c
0°
–
MILLIMETERS
L1
0.65 BSC
1.25 REF
10.20
NOM
1.75
7.80
5.30
0.75
28
4°
–
–
–
–
Microchip Technology Drawing C04-073B
10.50
MAX
2.00
8.20
0.38
1.85
5.60
0.95
0.25
8°
–
DS41291D-page 267
φ
L