PIC16F887-I/PT Microchip Technology Inc., PIC16F887-I/PT Datasheet - Page 270

• Manufacturer Part Number: PIC16F887-I/PT
• Description: MCU, 8-Bit, 8KW Flash, 368 RAM, 36 I/O, TQFP-44
• Manufacturer: Microchip Technology Inc.

Specifications of PIC16F887-I/PT

• A/d Inputs: 14-Channel, 10-Bit
• Comparators: 2
• Cpu Speed: 5 MIPS
• Eeprom Memory: 256 Bytes
• Frequency: 20 MHz
• Input Output: 35
• Interface: I2C/SPI/USART
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 44-pin TFQP
• Programmable Memory: 14K Bytes
• Ram Size: 368 Bytes
• Resistance, Drain To Source On: Bytes
• Serial Interface: MSSP or EUSART
• Speed: 20 MHz
• Timers: 2-8-bit, 1-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PIC16F882/883/884/886/887
DS41291D-page 268
28-Lead Plastic Quad Flat, No Lead Package (MM) – 6x6x0.9 mm Body [QFN-S]
with 0.40 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
A1
Preliminary
E
A
EXPOSED
NOTE 1
Units
A1
E2
D2
A3
PAD
N
A
E
D
K
e
b
L
E2
1
2
0.80
0.00
3.65
3.65
0.23
0.30
0.20
MIN
N
BOTTOM VIEW
MILLIMETERS
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.38
0.40
28
D2
–
Microchip Technology Drawing C04-124B
© 2007 Microchip Technology Inc.
MAX
1.00
0.05
4.70
0.43
0.50
4.70
–
L
b
e
K