RC28F256P30TFB Micron Technology Inc, RC28F256P30TFB Datasheet - Page 10

• Manufacturer Part Number: RC28F256P30TFB
• Manufacturer: Micron Technology Inc

Specifications of RC28F256P30TFB

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 100ns
• Interface Type: Parallel/Serial
• Boot Type: Top
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 16M
• Supply Current: 31mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Not Compliant

2.2
Figure 3:
Table 4:
Datasheet
10
Product Information
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Width
Package Body Length
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D
Corner to Ball A1 Distance Along E
Note:
E
Ball A1
Corner
A2
One dimple on package denotes Pin 1, which will always be in the upper left corner of the package, in
reference to the product mark.
G
B
C
D
E
F
H
A
Easy BGA Mechanical Specifications (256-Mbit, 512-Mbit)
Easy BGA Package Dimensions
64-Ball Easy BGA Package
1
Top View - Ball side down
A1
2
3
4
D
5
6
Symbol
A1
A2
S1
S2
A
b
D
E
N
Y
e
7
8
12.900
0.250
0.330
9.900
1.400
2.900
Min
-
-
-
-
-
A
Millimeters
A
G
B
C
D
H
E
F
10.000
13.000
0.780
0.430
1.000
1.500
3.000
Nom
64
8
-
-
-
Seating
Plane
Bottom View - Ball Side Up
7
10.100
13.100
1.200
0.530
0.100
1.600
3.100
Max
6
-
-
-
-
5
0.0098
0.0130
0.3898
0.5079
0.0551
0.1142
Note: Drawing not to scale
4
Min
-
-
-
-
-
3
2
Inches
0.0307
0.0169
0.3937
0.5118
0.0394
0.0591
0.1181
Nom
64
1
Order Number: 320002-10
-
-
-
Y
S1
0.0472
0.0209
0.3976
0.5157
0.0039
0.0630
0.1220
Max
Ball A1
Corner
-
-
-
-
b
e
S2
P30-65nm
Mar 2010