RC28F256P30TFB Micron Technology Inc, RC28F256P30TFB Datasheet - Page 6

• Manufacturer Part Number: RC28F256P30TFB
• Manufacturer: Micron Technology Inc

Specifications of RC28F256P30TFB

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 100ns
• Interface Type: Parallel/Serial
• Boot Type: Top
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 16M
• Supply Current: 31mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Not Compliant

1.3
Table 1:
Table 2:
Datasheet
6
Lower Param Die
Upper Param Die
Lower Param Die
Upper Param Die
Virtual Chip Enable Truth Table for 512 Mb (QUAD+ Package)
Virtual Chip Enable Truth Table for 512 Mb (Easy BGA Packages)
Virtual Chip Enable Description
The P30-65nm 512-Mbit devices employ a Virtual Chip Enable which combines two
256-Mbit die with a common chip enable, F1-CE# for QUAD+ packages or CE# for Easy
BGA packages. Refer to
maximum address bit is then used to select between the die pair with F1-CE#/CE#
asserted depending upon the package option used. When chip enable is asserted and
The maximum address bit is low (
enable is asserted and the maximum address bit is high (
is selected. Refer to
Die Selected
Die Selected
Table 1
Figure 9 on page 18
and
Table 2
V
IL
), The lower parameter die is selected; when chip
for additional details.
F1-CE#
and
CE#
L
L
L
L
Figure 10 on page 18
V
IH
), the upper parameter die
Order Number: 320002-10
for detail. The
A24
A25
H
H
L
L
P30-65nm
Mar 2010