RC28F256P30TFB Micron Technology Inc, RC28F256P30TFB Datasheet - Page 64

• Manufacturer Part Number: RC28F256P30TFB
• Manufacturer: Micron Technology Inc

Specifications of RC28F256P30TFB

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 100ns
• Interface Type: Parallel/Serial
• Boot Type: Top
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 16M
• Supply Current: 31mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Not Compliant

17.0
17.1
Figure 32: Decoder for Discrete P30-65nm
Note:
Datasheet
64
Device Density
Product Line Designator
Package Designator
JS = 56 -Lead TSOP, lead-free
RC = 64- Ball Easy BGA , leaded
PC = 64 - Ball Easy BGA, lead-free
256 = 256- Mbit
28F = Numonyx™ Flash Memory
The last digit is randomly assigned to cover packing media and/or features or other specific configuration
Ordering Information
Discrete Products
Table 30: Valid Combinations for Discrete Products
J
S 2
RC28F256P30BF*
RC28F256P30TF*
PC28F256P30BF*
JS28F256P30BF*
PC28F256P30TF*
JS28F256P30TF*
256-Mbit
8
F 2 5
6
P 3 0 B
F
*
Device Lithography
Device Features*
Product Family
Parameter Location
P 30 = Numonyx
V
V
65 nm
B = Bottom Parameter
T = Top Parameter
CC
CCQ
= 1. 7 – 2. 0 V
= 1. 7 – 3. 6 V
®
Axcell
Order Number: 320002-10
TM
Flash Memory (P30)
.
P30-65nm
Mar 2010