RC28F256P30TFB Micron Technology Inc, RC28F256P30TFB Datasheet - Page 77

• Manufacturer Part Number: RC28F256P30TFB
• Manufacturer: Micron Technology Inc

Specifications of RC28F256P30TFB

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 100ns
• Interface Type: Parallel/Serial
• Boot Type: Top
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 16M
• Supply Current: 31mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Not Compliant

P30-65nm
Table 44: CFI Link Information
Datasheet
77
P = 10Ah
A ddress
Offse t
(P+4A)h
(P+48)h
(P+49)h
(P+4B)h
(P+4C)h
152:
153:
154:
155:
156:
(1)
Le n
--FF
--FF
--FF
--FF
--FF
4
1
–B
–-
Disc rete
CFI Link Field bit definitions
CFI Link Field Quantity Subfield definitions
Bits 0–9 = Address offset (w ithin 32Mbit segment) of referenced CFI table
Bits 10–27 = nth 32Mbit segment of referenced CFI table
Bits 28–30 = Memory Type
Bit 31 = Another CFI Link field immediately follow s
Bits 0–3 = Quantity field (n such that n+1 equals quantity)
Bit 4 = Table & Die relative location
Bit 5 = Link Field & Table relative location
Bits 6–7 = Reserved
--FF
--FF
--FF
--FF
--FF
–T
–-
die 1 (B)
(Optional flas h features and com m ands )
--10
--20
--00
--00
--10
–B
die 2 (T)
--FF
--FF
--FF
--FF
--FF
De s cription
512-Mbit
die 1 (T)
--10
--20
--00
--00
--10
–T
die 2 (B)
--FF
--FF
--FF
--FF
--FF
Order Number: 320002-10
Add.
152:
153:
154:
155:
156:
Code Value
He x
below
below
table
table
See
See
Mar 2010