RC28F256P30TFB Micron Technology Inc, RC28F256P30TFB Datasheet - Page 3

• Manufacturer Part Number: RC28F256P30TFB
• Manufacturer: Micron Technology Inc

Specifications of RC28F256P30TFB

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 100ns
• Interface Type: Parallel/Serial
• Boot Type: Top
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 16M
• Supply Current: 31mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Not Compliant

P30 - 65 nm
Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Security Modes ........................................................................................................ 35
11.0 Registers ................................................................................................................. 38
Datasheet
3
Functional Description ............................................................................................... 5
1.1
1.2
1.3
1.4
Package Information ................................................................................................. 8
2.1
2.2
2.3
Ballouts ................................................................................................................... 13
Signals .................................................................................................................... 16
4.1
Bus Operations ........................................................................................................ 19
5.1
5.2
5.3
5.4
5.5
Command Set .......................................................................................................... 21
6.1
6.2
Read Operation........................................................................................................ 25
7.1
7.2
7.3
7.4
Program Operation .................................................................................................. 27
8.1
8.2
8.3
8.4
8.5
8.6
Erase Operations ..................................................................................................... 33
9.1
9.2
9.3
9.4
9.5
10.1
10.2
10.3
11.1
11.2
Introduction ....................................................................................................... 5
Overview ........................................................................................................... 5
Virtual Chip Enable Description.............................................................................. 6
Memory Maps ..................................................................................................... 7
56-Lead TSOP..................................................................................................... 8
64-Ball Easy BGA Package .................................................................................. 10
QUAD+ SCSP Packages ...................................................................................... 11
Dual-Die Configurations ..................................................................................... 18
Reads .............................................................................................................. 19
Writes.............................................................................................................. 19
Output Disable .................................................................................................. 19
Standby ........................................................................................................... 20
Reset............................................................................................................... 20
Device Command Codes ..................................................................................... 21
Device Command Bus Cycles .............................................................................. 22
Asynchronous Page-Mode Read ........................................................................... 25
Synchronous Burst-Mode Read............................................................................ 25
Read Device Identifier........................................................................................ 26
Read CFI .......................................................................................................... 26
Word Programming ........................................................................................... 27
Buffered Programming ....................................................................................... 27
Buffered Enhanced Factory Programming.............................................................. 28
Program Suspend .............................................................................................. 31
Program Resume............................................................................................... 31
Program Protection............................................................................................ 31
Block Erase ...................................................................................................... 33
Blank Check ..................................................................................................... 33
Erase Suspend .................................................................................................. 34
Erase Resume................................................................................................... 34
Erase Protection ................................................................................................ 34
Block Locking.................................................................................................... 35
Selectable One-Time Programmable Blocks........................................................... 37
Password Access ............................................................................................... 37
Read Status Register ......................................................................................... 38
Read Configuration Register................................................................................ 39
Order Number: 320002-10
Mar 2010