ISP1761BE STEricsson, ISP1761BE Datasheet - Page 152

• Manufacturer Part Number: ISP1761BE
• Manufacturer: STEricsson

Specifications of ISP1761BE

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: LQFP
• Rad Hardened: No
• Lead Free Status / Rohs Status: Supplier Unconfirmed

NXP Semiconductors
ISP1761_5
Product data sheet
18.4 Package related soldering information
Table 180. Suitability of through-hole mount IC packages for dipping and wave soldering
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Rev. 05 — 13 March 2008
Soldering method
Dipping
-
suitable
-
Hi-Speed USB OTG controller
Wave
suitable
suitable
not suitable
© NXP B.V. 2008. All rights reserved.
ISP1761
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