ISP1761BE STEricsson, ISP1761BE Datasheet - Page 5
ISP1761BE
Manufacturer Part Number
ISP1761BE
Description
Manufacturer
STEricsson
Datasheet
1.ISP1761BE.pdf
(164 pages)
Specifications of ISP1761BE
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
LQFP
Rad Hardened
No
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ISP1761BE
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
4. Ordering information
Table 1.
ISP1761_5
Product data sheet
Type number
ISP1761BE
ISP1761ET
Ordering information
Package
Name
LQFP128
TFBGA128 plastic thin fine-pitch ball grid array package; 128 balls; body 9
Description
plastic low profile quad flat package; 128 leads; body 14
Rev. 05 — 13 March 2008
20
Hi-Speed USB OTG controller
1.4 mm
9
0.8 mm
© NXP B.V. 2008. All rights reserved.
ISP1761
Version
SOT425-1
SOT857-1
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