MT48H32M32LFB5-6 IT:B Micron, MT48H32M32LFB5-6 IT:B Datasheet - Page 10

• Manufacturer Part Number: MT48H32M32LFB5-6 IT:B
• Manufacturer: Micron

Package Dimensions
Figure 4: 90-Ball VFBGA (8mm x 13mm)
PDF: 09005aef8404b23d
y68m_mobile_lpsdr.pdf – Rev. D 1/11 EN
Solder ball
material: SAC105
(98.5% Sn, 1% Ag,
0.5% Cu).
Dimensions apply
to solder balls post-
reflow on Ø0.4 SMD
ball pads.
Seating
90X Ø0.45
plane
0.12 A
11.2 CTR
0.8 TYP
Note:
A
9 8 7
1. All dimensions are in millimeters.
0.8 TYP
6.4 CTR
8 ±0.1
3 2 1
0.65 ±0.05
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
10
13 ±0.1
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x32 Mobile LPSDR SDRAM
0.275 MIN
1.0 MAX
Package Dimensions
© 2010 Micron Technology, Inc. All rights reserved.
Ball A1 ID