C8051T322-GQR Silicon Labs, C8051T322-GQR Datasheet - Page 30

• Manufacturer Part Number: C8051T322-GQR
• Description: 8-bit Microcontrollers - MCU USB-OTP-16K-LQFP32
• Manufacturer: Silicon Labs

Specifications of C8051T322-GQR

• Rohs: yes
• Core: 8051
• Processor Series: C8051
• Data Bus Width: 8 bit

C8051T620/621/320/321/322/323
30
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
7. A 3x3 array of 1.0 mm openings on a 1.2 mm pitch should be used for the center pad to
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60 m minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume.
Small Body Components.
Figure 5.2. QFN-32 Recommended PCB Land Pattern
Table 5.2. QFN-32 PCB Land Pattern Dimensions
4.80
4.80
0.20
Min
0.50 BSC
0.30
Max
4.90
4.90
Rev. 1.1
Dimension
X2
Y1
Y2
3.20
0.75
3.20
Min
Max
3.40
0.85
3.40