MC9S08DZ60MLC Freescale Semiconductor, MC9S08DZ60MLC Datasheet - Page 146

IC MCU 60K FLASH 4K RAM 32-LQFP

MC9S08DZ60MLC

Manufacturer Part Number
MC9S08DZ60MLC
Description
IC MCU 60K FLASH 4K RAM 32-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08DZ60MLC

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
32-LQFP
For Use With
DEMO9S08DZ60 - BOARD DEMOEVB9S08DZ60 - BOARD EVAL FOR 9S08DZ60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08DZ60MLC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
IREFS=1
CLKS=01
PLLS=0
BDM Disabled
and LP=1
Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
8.4
8.4.1
146
Functional Description
Operational Modes
Internal (BLPI)
Low Power
Entered from any state
when MCU enters stop
Bypassed
BDM Enabled
or LP=0
IREFS=1
CLKS=00
PLLS=0
IREFS=1
CLKS=01
PLLS=0
FLL Engaged
Internal (FEI)
FLL Bypassed
Internal (FBI)
MC9S08DZ60 Series Data Sheet, Rev. 4
Figure 8-8. Clock Switching Modes
Stop
FLL Engaged
External (FEE)
PLL Bypassed
External (PBE)
FLL Bypassed
External (FBE)
PLL Engaged
External (PEE)
Returns to state that was active
before MCU entered stop, unless
RESET occurs while in stop.
IREFS=0
CLKS=00
PLLS=0
BDM Enabled
or LP=0
BDM Enabled
or LP=0
IREFS=0
CLKS=10
PLLS=0
IREFS=0
CLKS=10
PLLS=1
IREFS=0
CLKS=00
PLLS=1
External (BLPE)
Low Power
Bypassed
Freescale Semiconductor
IREFS=0
CLKS=10
BDM Disabled
and LP=1

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