MC9S08DZ60MLC Freescale Semiconductor, MC9S08DZ60MLC Datasheet - Page 195

IC MCU 60K FLASH 4K RAM 32-LQFP

MC9S08DZ60MLC

Manufacturer Part Number
MC9S08DZ60MLC
Description
IC MCU 60K FLASH 4K RAM 32-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08DZ60MLC

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
32-LQFP
For Use With
DEMO9S08DZ60 - BOARD DEMOEVB9S08DZ60 - BOARD EVAL FOR 9S08DZ60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08DZ60MLC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
10.6
This section contains information for using the ADC module in applications. The ADC has been designed
to be integrated into a microcontroller for use in embedded control applications requiring an A/D
converter.
10.6.1
The following sections discuss the external pins associated with the ADC module and how they should be
used for best results.
10.6.1.1
The ADC module has analog power and ground supplies (V
on some devices. V
devices, V
pads for the analog supplies bonded to the same pin as the corresponding digital supply so that some degree
of isolation between the supplies is maintained.
When available on a separate pin, both V
as their corresponding MCU digital supply (V
noise immunity and bypass capacitors placed as near as possible to the package.
If separate power supplies are used for analog and digital power, the ground connection between these
supplies must be at the V
possible. The V
10.6.1.2
In addition to the analog supplies, the ADC module has connections for two reference voltage inputs. The
high reference is V
reference is V
When available on a separate pin, V
driven by an external source between the minimum V
never exceed V
potential as V
capacitors placed as near as possible to the package.
AC current in the form of current spikes required to supply charge to the capacitor array at each successive
approximation step is drawn through the V
current demand is a 0.1 μF capacitor with good high frequency characteristics. This capacitor is connected
between V
path is not recommended because the current causes a voltage drop that could result in conversion errors.
Inductance in this path must be minimum (parasitic only).
Freescale Semiconductor
Application Information
SSAD
REFH
External Pins and Routing
Analog Supply Pins
Analog Reference Pins
SSAD
REFL
DDAD
SSAD
and V
and V
. V
, which may be shared on the same pin as V
REFH
SSAD
). When available on a separate pin, V
pin makes a good single point ground location.
REFH
DDAD
REFL
, which may be shared on the same pin as V
is shared on the same pin as the MCU digital V
SSAD
and V
are shared with the MCU digital supply pins. In these cases, there are separate
and must be placed as near as possible to the package pins. Resistance in the
pin. This should be the only ground connection between these supplies if
REFL
MC9S08DZ60 Series Data Sheet, Rev. 4
REFH
must be routed carefully for maximum noise immunity and bypass
DDAD
may be connected to the same potential as V
REFH
DD
and V
and V
and V
SSAD
REFL
DDAD
SS
must be connected to the same voltage potential
) and must be routed carefully for maximum
loop. The best external component to meet this
REFL
spec and the V
DDAD
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
SSAD
must be connected to the same voltage
and V
DDAD
on some devices.
SSAD
SS
on some devices. The low
DDAD
on some devices. On other
) available as separate pins
potential (V
DDAD
, or may be
REFH
must
195

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