MT46V16M16P-5B:K Micron Technology Inc, MT46V16M16P-5B:K Datasheet - Page 60

DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.6V 66-Pin TSOP Tray

MT46V16M16P-5B:K

Manufacturer Part Number
MT46V16M16P-5B:K
Description
DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.6V 66-Pin TSOP Tray
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet

Specifications of MT46V16M16P-5B:K

Density
256 Mb
Maximum Clock Rate
400 MHz
Package
66TSOP
Address Bus Width
15 Bit
Operating Supply Voltage
2.6 V
Maximum Random Access Time
0.7 ns
Operating Temperature
0 to 70 °C
Organization
16Mx16
Address Bus
15b
Access Time (max)
700ps
Operating Supply Voltage (typ)
2.6V
Package Type
TSOP
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.5V
Supply Current
260mA
Pin Count
66
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant

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Table 35:
Operating Mode
Extended Mode Register
Output Drive Strength
DLL Enable/Disable
PDF: 09005aef80768abb/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN
Speed
-6/-6T
-75E
-75Z
-5B
-75
CAS Latency
The normal operating mode is selected by issuing an LMR command with bits A7–An
each set to zero and bits A0–A6 set to the desired values. A DLL reset is initiated by
issuing an LMR command with bits A7 and A9–An each set to zero, bit A8 set to one, and
bits A0–A6 set to the desired values. Although not required by the Micron device, JEDEC
specifications recommend that an LMR command resetting the DLL should always be
followed by an LMR command selecting normal operating mode.
All other combinations of values for A7–An are reserved for future use and/or test
modes. Test modes and reserved states should not be used, as unknown operation or
incompatibility with future versions may result.
The extended mode register controls functions beyond those controlled by the mode
register; these additional functions are DLL enable/disable and output drive strength.
These functions are controlled via the bits shown in Figure 25 on page 59. The extended
mode register is programmed via the LMR command to the mode register (with BA0 = 1
and BA1 = 0) and will retain the stored information until it is programmed again or until
the device loses power. The enabling of the DLL should always be followed by an LMR
command to the mode register (BA0/BA1 = 0) to reset the DLL. The extended mode
register must be loaded when all banks are idle and no bursts are in progress, and the
controller must wait the specified time before initiating any subsequent operation.
Violating either requirement could result in an unspecified operation.
The normal drive strength for all outputs is specified to be SSTL_2, Class II. The Design
Revision F and K devices support a programmable option for reduced drive. This option
is intended for the support of the lighter load and/or point-to-point environments. The
selection of the reduced drive strength will alter the DQ and DQS pins from SSTL_2,
Class II drive strength to a reduced drive strength, which is approximately 54% of the
SSTL_2, Class II drive strength.
When the part is running without the DLL enabled, device functionality may be altered.
The DLL must be enabled for normal operation. DLL enable is required during power-
up initialization and upon returning to normal operation after having disabled the DLL
for the purpose of debug or evaluation (when the device exits self refresh mode, the DLL
is enabled automatically). Anytime the DLL is enabled, 200 clock cycles with CKE HIGH
must occur before a READ command can be issued.
75 ≤ f ≤ 133
75 ≤ f ≤ 133
75 ≤ f ≤ 133
75 ≤ f ≤ 133
75 ≤ f ≤ 100
CL = 2
Allowable Operating Clock Frequency (MHz)
58
75 ≤ f ≤ 167
75 ≤ f ≤ 167
75 ≤ f ≤ 133
75 ≤ f ≤ 133
75 ≤ f ≤ 133
CL = 2.5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR SDRAM
©2003 Micron Technology, Inc. All rights reserved.
133 ≤ f ≤ 200
CL = 3
Operations

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