ALXD800EEXJ2VC C3 AMD (ADVANCED MICRO DEVICES), ALXD800EEXJ2VC C3 Datasheet - Page 608

• Manufacturer Part Number: ALXD800EEXJ2VC C3
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ALXD800EEXJ2VC C3

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Note 1. RESET# is asynchronous. The setup/hold times stated are for testing purposes that require sequential repeatabil-
Note 2.
608
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
CK
CH
CL
SU1
H1
SU2
H2
VAL1
VAL2
ON
MVON
RSTX
Z
ity.
last.
For proper powerup of DRGB and flat panel controls, V
Parameter
SYSREF Cycle time
SYSREF High time
SYSREF Low time
RESET# Setup time to SYSREF
RESET# Hold time from SYSREF
CIS Setup time to SYSREF
CIS Hold time from SYSREF
IRQ13 Valid Delay time from SYSREF
SUSPA# Valid Delay time from SYSREF
V
MVREF power on after V
Reset Active time after SYSREF clock stable
Output drive delay after RESET# released
Figure 7-3. Drive Level and Measurement Points for Switching Characteristics
IO
and V
SYSREF
Outputs
33234H
MEM
Inputs
power on after V
Valid Output
t
VAL1,2
MEM
Table 7-8. System Interface Signals
Min
t
CORE
CH
n
t
SU1,2
t
IO
VAL1,2
must power up after V
Valid Output
Valid Input
15.0
Min
100
Max
6.0
6.0
3.0
2.0
2.0
3
1
0
0
0
t
t
CK
CL
n+1
AMD Geode™ LX Processors Data Book
Max
100
100
INF
6.0
6.0
20
t
H1,2
CORE
. Otherwise, V
Unit
50%
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
ns
50%
Electrical Specifications
50%
Comments
40% t
40% t
Note 1
Note 1
Note 2
For PLL lock
66 MHz
CORE
CK
CK
can be