EP1S10F484I6 Altera, EP1S10F484I6 Datasheet - Page 301

• Manufacturer Part Number: EP1S10F484I6
• Description: IC STRATIX FPGA 10K LE 484-FBGA
• Manufacturer: Altera
• Series: Stratix®r

Specifications of EP1S10F484I6

• Number Of Logic Elements/cells: 10570
• Number Of Labs/clbs: 1057
• Total Ram Bits: 920448
• Number Of I /o: 335
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 484-FBGA
• Family Name: Stratix
• Number Of Logic Blocks/elements: 10570
• # I/os (max): 335
• Frequency (max): 450.05MHz
• Process Technology: 0.13um (CMOS)
• Operating Supply Voltage (typ): 1.5V
• Logic Cells: 10570
• Ram Bits: 920448
• Operating Supply Voltage (min): 1.425V
• Operating Supply Voltage (max): 1.575V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 484
• Package Type: FC-FBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Not Compliant

Contents
Chapter 8. Implementing 10-Gigabit Ethernet Using Stratix & Stratix GX Devices
Chapter 9. Implementing SFI-4 in Stratix & Stratix GX Devices
Chapter 10. Transitioning APEX Designs to Stratix & Stratix GX Devices
Altera Corporation
Introduction ............................................................................................................................................ 8–1
10-Gigabit Ethernet ................................................................................................................................ 8–1
Interfaces ................................................................................................................................................. 8–5
I/O Characteristics for XSBI, XGMII & XAUI ................................................................................. 8–21
Introduction ............................................................................................................................................ 9–1
Introduction .......................................................................................................................................... 10–1
General Architecture ........................................................................................................................... 10–1
TriMatrix Memory ............................................................................................................................... 10–8
DSP Block ............................................................................................................................................ 10–16
PLLs & Clock Networks ................................................................................................................... 10–18
I/O Structure ...................................................................................................................................... 10–25
Configuration ..................................................................................................................................... 10–30
Related Links ..................................................................................................................................... 8–1
XSBI .................................................................................................................................................... 8–5
XGMII ............................................................................................................................................... 8–13
XAUI ................................................................................................................................................. 8–19
Software Implementation .............................................................................................................. 8–22
AC/DC Specifications ................................................................................................................... 8–22
10-Gigabit Ethernet MAC Core .................................................................................................... 8–24
Conclusion ....................................................................................................................................... 8–25
System Topology .............................................................................................................................. 9–3
Interface Implementation in Stratix & Stratix GX Devices ......................................................... 9–5
AC Timing Specifications .............................................................................................................. 9–10
Electrical Specifications ................................................................................................................. 9–12
Software Implementation .............................................................................................................. 9–13
Conclusion ....................................................................................................................................... 9–13
Logic Elements ................................................................................................................................ 10–2
MultiTrack Interconnect ................................................................................................................ 10–3
DirectDrive Technology ................................................................................................................ 10–4
Architectural Element Names ...................................................................................................... 10–5
Same-Port Read-During-Write Mode ........................................................................................ 10–10
Mixed-Port Read-During-Write Mode ...................................................................................... 10–11
Memory Megafunctions .............................................................................................................. 10–12
FIFO Conditions ........................................................................................................................... 10–13
Design Migration Mode in Quartus II Software ...................................................................... 10–13
DSP Block Megafunctions ........................................................................................................... 10–16
Clock Networks ............................................................................................................................ 10–18
PLLs ................................................................................................................................................ 10–19
External RAM Interfacing ........................................................................................................... 10–25
I/O Standard Support ................................................................................................................. 10–26
High-Speed Differential I/O Standards .................................................................................... 10–26
altlvds Megafunction ................................................................................................................... 10–29
Contents
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