OM11077 NXP Semiconductors, OM11077 Datasheet - Page 7

• Manufacturer Part Number: OM11077
• Description: MODULE DIMM LPC2478 ARM7
• Manufacturer: NXP Semiconductors

Specifications of OM11077

• Accessory Type: Module Card
• For Use With/related Products: ARM-57TS-LPC2478
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4742

NXP Semiconductors
Table 6.
Table 7.
Table 8.
Table 9.
UM10237_4
User manual
Type number
LPC2420FBD208
LPC2460FBD208
LPC2460FET208
Type number
LPC2468FBD208 LQFP208
LPC2468FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm SOT950-1
Type number
LPC2468FBD208
LPC2468FET208
Type number
LPC2470FBD208 LQFP208
LPC2470FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 ×
LPC2420/60 ordering options
LPC2468 ordering information
LPC2468 ordering options
LPC2470 ordering information
5.3 LPC2468 ordering options
5.4 LPC2470 ordering options
Package
Name
Package
Name
Flash
(kB)
512
512
Flash
(kB)
N/A
N/A
N/A
64 16 16 2
64 16 16 2
64 -
64 16 16 2
64 16 16 2
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
0.7 mm
SRAM (kB)
SRAM (kB)
16 2
98 Full 32-bit
98 Full 32-bit
82 Full 32-bit
98 Full 32-bit
98 Full 32-bit
Rev. 04 — 26 August 2009
External
bus
External
bus
Ethernet
MII/
RMII
MII/
RMII
Ethernet
-
MII/RMII
MII/RMII
Chapter 1: LPC24XX Introductory information
USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
yes
yes
USB
OTG/
OHCI/
DEV
+ 4 kB
FIFO
yes
yes
yes
2
2
2
2
-
SD/
MMC
yes
yes
SD/
MMC
yes
yes
yes
GP
DMA
yes
yes
yes
GP
DMA
yes
yes
UM10237
© NXP B.V. 2009. All rights reserved.
8
8
8
8
8
1
1
1
1
1
Version
SOT459-1
Version
SOT459-1
SOT950-1
Temp
range
−40 °C to
+85 °C
−40 °C to
+85 °C
−40 °C to
+85 °C
Temp
range
−40 °C to
+85 °C
−40 °C to
+85 °C
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