MC68HC908RF2CFA Freescale Semiconductor, MC68HC908RF2CFA Datasheet - Page 186

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MC68HC908RF2CFA

Manufacturer Part Number
MC68HC908RF2CFA
Description
IC MCU W/UHF TX 2K FLASH 32LQFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet

Specifications of MC68HC908RF2CFA

Core Processor
HC08
Core Size
8-Bit
Speed
4MHz
Peripherals
LVD, POR, PWM, RF Mod
Number Of I /o
12
Program Memory Size
2KB (2K x 8)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Connectivity
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC908RF2CFA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC68HC908RF2CFA
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MC68HC908RF2CFA
Quantity:
119
Ordering Information and Mechanical
15.3 32-Pin LQFP Package (Case No. 873A)
Data Sheet
186
SEATING
PLANE
9
B
C
–AB–
–AC–
B1
E
–T–
H
8
1
8X
M
DETAIL AD
32
W
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
Freescale Semiconductor, Inc.
Ordering Information and Mechanical Specifications
For More Information On This Product,
X
–Z–
25
K
R
4X
17
4X
Q
Go to: www.freescale.com
0.20 (0.008)
–U–
0.20 (0.008)
V1
DETAIL AD
V
AB
AC
T–U
SECTION AE–AE
F
É É
É É
É É
É É
T–U
METAL
BASE
Z
N
J
Z
D
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER MAY VARY
Y14.5M, 1982.
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –AB–.
SEATING PLANE –AC–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
0.0076 (0.0003).
FROM DEPICTION.
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
DETAIL Y
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.200 REF
1.000 REF
1
12 REF
MC68HC908RF2 — Rev. 4.0
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
5
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
12 REF
1
INCHES
AE
AE
MAX
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
0.010
5
MOTOROLA

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