LPC2917_19_01 NXP Semiconductors, LPC2917_19_01 Datasheet - Page 59

The LPC2917/2919/01 combine an ARM968E-S CPU core with two integrated TCMblocks operating at frequencies of up to 125 MHz, CAN and LIN, 56 kB SRAM, up to768 kB flash memory, external memory interface, two 10-bit ADCs, and multiple serial andparallel

LPC2917_19_01

Manufacturer Part Number
LPC2917_19_01
Description
The LPC2917/2919/01 combine an ARM968E-S CPU core with two integrated TCMblocks operating at frequencies of up to 125 MHz, CAN and LIN, 56 kB SRAM, up to768 kB flash memory, external memory interface, two 10-bit ADCs, and multiple serial andparallel
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
Table 32.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
LPC2917_19_01_3
Product data sheet
Symbol
ESD
V
ESD
Based on package heat transfer, not device power consumption.
Peak current must be limited at 25 times average current.
For I/O Port 0, the maximum input voltage is defined by V
Only when V
Note that pull-up should be off. With pull-up do not exceed 3.6 V.
112 mA per V
Human-body model: discharging a 100 pF capacitor via a 10 kΩ series resistor.
Limiting values
DD(IO)
Parameter
electrostatic discharge
voltage
DD(IO)
is present.
or V
SS(IO)
…continued
should not be exceeded.
Conditions
on all pins
on corner pins
human body model
charged device model
charged device model
Rev. 03 — 9 December 2009
I(ADC)
.
LPC2917/01; LPC2919/01
ARM9 microcontroller with CAN and LIN
[7]
Min
−2000
−500
−750
Max
+2000
+500
+750
© NXP B.V. 2009. All rights reserved.
Unit
V
V
V
59 of 86

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