LPC2917_19_01 NXP Semiconductors, LPC2917_19_01 Datasheet - Page 70

• Manufacturer Part Number: LPC2917_19_01
• Description: The LPC2917/2919/01 combine an ARM968E-S CPU core with two integrated TCMblocks operating at frequencies of up to 125 MHz, CAN and LIN, 56 kB SRAM, up to768 kB flash memory, external memory interface, two 10-bit ADCs, and multiple serial andparallel
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 36.
V
ground; positive currents flow into the IC; unless otherwise specified
[1]
[2]
[3]
Table 37.
V
T
specified.
[1]
LPC2917_19_01_3
Product data sheet
Symbol
t
Symbol
f
t
f(o)
SPI
su(SPI_MISO)
vj
DD(CORE)
DD(CORE)
= -40
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
Bus capacitance C
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
°
[1]
C to +85
= V
= V
Dynamic characteristic: I
Dynamic characteristics of SPI pins
DD(OSC_PLL)
DD(OSC_PLL)
Parameter
SPI operating frequency
SPI_MISO set-up time
9.2 Dynamic characteristics: I
9.3 Dynamic characteristics: SPI
Parameter
output fall time
°
C; all voltages are measured with respect to ground; positive currents flow into the IC; unless otherwise
b
in pF, from 10 pF to 400 pF.
; V
; V
Fig 26. SPI data input set-up time in SSP Master mode
DD(IO)
DD(IO)
SDOn
SCKn
shifting edges
SDIn
= 2.7 V to 3.6 V; V
= 2.7 V to 3.6 V; V
2
C-bus pins
Rev. 03 — 9 December 2009
Conditions
master operation
slave operation
T
measured in SPI
Master mode;
see
DDA(ADC3V3)
amb
DDA(ADC3V3)
Figure 26
Conditions
V
= 25 °C;
amb
amb
IH
to V
= 25 °C (final testing). Both pre-testing and final testing use correlated
= 25 °C (final testing). Both pre-testing and final testing use correlated
2
C-bus interface
= 3.0 V to 3.6 V; all voltages are measured with respect to
IL
LPC2917/01; LPC2919/01
= 3.0 V to 3.6 V; V
t
su(SPI_MISO)
[1]
ARM9 microcontroller with CAN and LIN
Min
20 + 0.1 × C
Min
1
1
-
⁄
⁄
65024
65024
DDA(ADC5V0)
f
f
clk(SPI)
clk(SPI)
b
[3]
Typ
-
= 3.0 V to 5.5 V;
Typ
-
-
11
[2]
sampling edges
© NXP B.V. 2009. All rights reserved.
Max
1
1
-
⁄
⁄
2
4
amb
amb
Max
-
f
f
clk(SPI)
clk(SPI)
= 85 °C ambient
= 85 °C ambient
002aae695
Unit
MHz
MHz
ns
Unit
ns
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