M30240ECFP MITSUBISHI [Mitsubishi Electric Semiconductor], M30240ECFP Datasheet - Page 7

• Manufacturer Part Number: M30240ECFP
• Description: M30240 Group Specification
• Manufacturer: MITSUBISHI [Mitsubishi Electric Semiconductor]

Preliminary Specifications REV. E
Specifications in this manual are tentative and subject to change
Performance outline
Figure 1.3:
Table 1.2:
M30240M5
M30240M6
M30240ECFP
Mitsubishi plans to release the following products in the M30240 group:
Table 1.2 shows the Package Number, type, ROM and RAM Capacity for M30240 Group.
(1) Support for mask ROM version and one-time PROM version
(2) ROM capacity
(3) Package
Figure 1.3 shows the type number, memory size and package for the M30240 group.
Type
•
Type No.
80P6N: Plastic molded QFP (mask ROM version and one-time PROM version)
Type number, memory size, and package
M30240 Group
ROM Capacity
M 3 0 24 0 M 5 – X X X F P
128K bytes
40K bytes
48K bytes
RAM Capacity
3K bytes
3K bytes
5K bytes
1-7
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
ROM No.
Memory type:
Package type:
Part type:
Specifies part variations with M30240 group
M30240 Group
M16C Family
ROM capacity:
1: 8K bytes
2: 16K bytes
3: 24K bytes
4: 32K bytes
5: 40K bytes
6: 48K bytes
Omitted for blank one-time PROM version,and
EPROM version
M : Mask ROM version
E : EPROM or one-time PROM version
S : External ROM version
F : Flash memory version
FP : Package
Package Type
80P6N
80P6N
80P6N
80P6N
7: 56K bytes
8: 64K bytes
9: 80K bytes
A: 96K bytes
C: 128K bytes
Mask ROM Version
Mask ROM Version
One-time PROM version
Mitsubishi microcomputers
M30240 Group
Remarks