DSPIC33EP128MC504-I/ML Microchip Technology, DSPIC33EP128MC504-I/ML Datasheet - Page 12

• Manufacturer Part Number: DSPIC33EP128MC504-I/ML
• Description: Digital Signal Processors & Controllers - DSP, DSC 16B 128KB FL 16KBR 60MHz 44P OpAmps
• Manufacturer: Microchip Technology
• Type: dsPIC33E/PIC24Er

Specifications of DSPIC33EP128MC504-I/ML

• Rohs: yes
• Core: dsPIC33E
• Data Bus Width: 16 bit
• Program Memory Size: 128 KB
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 7.37 MHz, 32 kHz
• Number Of Programmable I/os: 35
• Number Of Timers: 5 x 16-bit, 2 x 32-bit
• Device Million Instructions Per Second: 70 MIPs
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Package / Case: TQFP-44
• Mounting Style: SMD/SMT
• Family / Core: dsPIC33E/PIC24E
• Interface Type: CAN, I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: Yes
• Product: DSPs
• Program Memory Type: Flash
• Supply Current: 10 mA

dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
Pin Diagrams (Continued)
DS70657F-page 12
44-Pin VTLA
Note 1: The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See
2: Every I/O port pin (RAx-RGx) can be used as change notification (CNAx-CNGx). See
3: The metal pad at the bottom of the device is not connected to any pins and is recommended to be
“Peripheral Pin Select”
“I/O Ports”
connected to V
TMS/ASDA1/RP41/RB9
(3)
RPI45/CTPLS/RB13
RP42/RB10
RPI44/RB12
RP43/RB11
RP54/RC6
RP55/RC7
RP56/RC8
RP57/RC9
for more information.
SS
V
V
CAP
SS
externally.
10
44
11
1
2
3
4
5
6
7
8
9
43
12
for available peripherals and for information on limitations.
13 14 15
42
dsPIC33EPXXXGP504
41
PIC24EPXXXGP204
40 39
16 17
38 37 36 35
18
19
20 21
34
33
32
31
30
29
28
27
26
25
24
23
22
SCL2/RP36/RB4
SDA2/RPI24/RA8
OSC2/CLKO/RA3
OSC1/CLKI/RA2
V
V
AN8/C3IN1+/U1RTS/BCLK1/RC2
AN7/C3IN1-/C4IN1-/RC1
AN6/OA3OUT/C4IN1+/OCFB/RC0
PGED1/AN5/C1IN1-/RP35/RB3
PGEC1/AN4/C1IN1+/RPI34/RB2
SS
DD
 2011-2012 Microchip Technology Inc.
= Pins are up to 5V tolerant
Section 11.4
Section 11.0