DSPIC33EP128MC504-I/ML Microchip Technology, DSPIC33EP128MC504-I/ML Datasheet - Page 29

• Manufacturer Part Number: DSPIC33EP128MC504-I/ML
• Description: Digital Signal Processors & Controllers - DSP, DSC 16B 128KB FL 16KBR 60MHz 44P OpAmps
• Manufacturer: Microchip Technology
• Type: dsPIC33E/PIC24Er

Specifications of DSPIC33EP128MC504-I/ML

• Rohs: yes
• Core: dsPIC33E
• Data Bus Width: 16 bit
• Program Memory Size: 128 KB
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 7.37 MHz, 32 kHz
• Number Of Programmable I/os: 35
• Number Of Timers: 5 x 16-bit, 2 x 32-bit
• Device Million Instructions Per Second: 70 MIPs
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Package / Case: TQFP-44
• Mounting Style: SMD/SMT
• Family / Core: dsPIC33E/PIC24E
• Interface Type: CAN, I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: Yes
• Product: DSPs
• Program Memory Type: Flash
• Supply Current: 10 mA

2.5
The PGECx and PGEDx pins are used for ICSP and
debugging purposes. It is recommended to keep the
trace length between the ICSP connector and the ICSP
pins on the device as short as possible. If the ICSP con-
nector is expected to experience an ESD event, a
series resistor is recommended, with the value in the
range of a few tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
ICE™.
For more information on ICD 2, ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site.
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
 2011-2012 Microchip Technology Inc.
IH
Guide” DS51616
(poster) DS51749
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
) and input low (V
®
ICSP Pins
PICkit™ 3, MPLAB ICD 3, or MPLAB REAL
®
®
ICD 3 Design Advisory” DS51764
REAL ICE™ In-Circuit Emulator User’s
®
®
REAL ICE™ In-Circuit Emulator”
ICD 3” (poster) DS51765
IL
) requirements.
2.6
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator. For details, see
“Oscillator Configuration”
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in
FIGURE 2-3:
Oscillator Pins
Main Oscillator
Guard Ring
Guard Trace
External Oscillator Pins
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
for details.
Figure
2-3.
DS70657F-page 29
Section 9.0