C8051F021-GQ Silicon Laboratories Inc, C8051F021-GQ Datasheet - Page 147

IC 8051 MCU 64K FLASH 64TQFP

C8051F021-GQ

Manufacturer Part Number
C8051F021-GQ
Description
IC 8051 MCU 64K FLASH 64TQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F02xr
Datasheets

Specifications of C8051F021-GQ

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
64-TQFP, 64-VQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
32
Ram Size
4.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x8b, 8x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F0x
Core
8051
Data Bus Width
8 bit
Data Ram Size
4.25 KB
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
32
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F020DK
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 8-bit or 8-ch x 12-bit
On-chip Dac
2-ch x 12-bit
No. Of I/o's
32
Ram Memory Size
4352Byte
Cpu Speed
25MHz
No. Of Timers
5
No. Of Pwm Channels
5
Rohs Compliant
Yes
Data Rom Size
64 KB
A/d Bit Size
12 bit
A/d Channels Available
8
Height
1.05 mm
Length
10 mm
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Width
10 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1200 - DEV KIT FOR F020/F021/F022/F023
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1201

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22
Bits7-0:
Bits7-6:
Bit5:
Bit4:
Bits3-2:
Bits1-0:
PGSEL7
R/W
R/W
Bit7
Bit7
-
PGSEL[7:0]: XRAM Page Select Bits.
The XRAM Page Select Bits provide the high byte of the 16-bit external data memory address when
using an 8-bit MOVX command, effectively selecting a 256-byte page of RAM.
0x00: 0x0000 to 0x00FF
0x01: 0x0100 to 0x01FF
...
0xFE: 0xFE00 to 0xFEFF
0xFF: 0xFF00 to 0xFFFF
Unused. Read = 00b. Write = don’t care.
PRTSEL: EMIF Port Select.
0: EMIF active on P0-P3.
1: EMIF active on P4-P7.
EMD2: EMIF Multiplex Mode Select.
0: EMIF operates in multiplexed address/data mode.
1: EMIF operates in non-multiplexed mode (separate address and data pins).
EMD1-0: EMIF Operating Mode Select.
These bits control the operating mode of the External Memory Interface.
00: Internal Only: MOVX accesses on-chip XRAM only. All effective addresses alias to on-chip
memory space.
01: Split Mode without Bank Select: Accesses below the 4k boundary are directed on-chip. Accesses
above the 4k boundary are directed off-chip. 8-bit off-chip MOVX operations use the current contents
of the Address High port latches to resolve upper address byte. Note that in order to access off-chip
space, EMI0CN must be set to a page that is not contained in the on-chip address space.
10: Split Mode with Bank Select: Accesses below the 4k boundary are directed on-chip. Accesses
above the 4k boundary are directed off-chip. 8-bit off-chip MOVX operations use the contents of
EMI0CN to determine the high-byte of the address.
11: External Only: MOVX accesses off-chip XRAM only. On-chip XRAM is not visible to the CPU.
EALE1-0: ALE Pulse-Width Select Bits (only has effect when EMD2 = 0).
00: ALE high and ALE low pulse width = 1 SYSCLK cycle.
01: ALE high and ALE low pulse width = 2 SYSCLK cycles.
10: ALE high and ALE low pulse width = 3 SYSCLK cycles.
11: ALE high and ALE low pulse width = 4 SYSCLK cycles.
PGSEL6
R/W
R/W
Bit6
Bit6
-
Figure 16.1. EMI0CN: External Memory Interface Control
Figure 16.2. EMI0CF: External Memory Configuration
PGSEL5
PRTSEL
R/W
R/W
Bit5
Bit5
PGSEL4
EMD2
R/W
R/W
Bit4
Bit4
PGSEL3
EMD1
R/W
R/W
Bit3
Bit3
Rev. 1.4
PGSEL2
EMD0
R/W
R/W
Bit2
Bit2
PGSEL1
EALE1
C8051F020/1/2/3
R/W
R/W
Bit1
Bit1
PGSEL0
EALE0
R/W
R/W
Bit0
Bit0
SFR Address:
SFR Address:
00000000
00000011
Reset Value
Reset Value
0xAF
0xA3
147

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